公开(公告)号：USD1031676S1

公开(公告)日：2024-06-18

申请号：US29760951

申请日：2020-12-04

Applicant: ASM IP HOLDING B.V.

Designer： Peipei Gao ,  Wentao Wang ,  Xing Lin ,  Han Ye ,  Ion Hong Chao ,  Siyao Luan ,  Alexandros Demos ,  Fan Gao

Abstract: FIG. 1 is a front perspective view of a combined susceptor, support, and lift system;
FIG. 2 is a back perspective view thereof;
FIG. 3 is a side view thereof;
FIG. 4 is a cross-sectional view taken along line 4-4 as indicated in FIG. 3;
FIG. 5 is an enlarged view of FIG. 4 shown without broken line environmental subject matter for clarity of the claimed subject matter;
FIG. 6 is a top perspective view of the lift pin thereof;
FIG. 7 is a bottom perspective view of the lift pin thereof;
FIG. 8 is a front view of the lift pin thereof;
FIG. 9 is a back view of the lift pin thereof;
FIG. 10 is a left view of the lift pin thereof;
FIG. 11 is a right view of the lift pin thereof;
FIG. 12 is a top view of the lift pin thereof; and,
FIG. 13 is a bottom view of the lift pin thereof.
The dash-dash broken lines within the shaded area and the dash-dash broken lines in FIGS. 1-13 depicting various components of the susceptor, support, and lift system are for the purpose of illustrating environmental subject matter and portions of the article that form no part of the claimed design. The dot-dash broken line in FIG. 3 is for the purpose of defining the cross-sectional view shown in FIG. 4.

公开(公告)号：US20220189804A1

公开(公告)日：2022-06-16

申请号：US17549311

申请日：2021-12-13

Applicant: ASM IP Holding B.V.

Inventor： Siyao Luan ,  Peipei Gao ,  Xing Lin ,  Alexandros Demos ,  Kishor Patil

IPC: H01L21/67 ,  C23C16/458 ,  C23C16/455

Abstract: A fixture includes a frame, a leveling plate, a bracket, and a laser profiler. The frame is arranged for fixation above a reaction chamber arranged to deposit a film onto a substrate. The leveling plate is supported on the frame. The bracket is supported on the leveling plate. The laser profiler is suspended from the bracket, overlays the reaction chamber, and has a field of view that extends through the leveling plate and the frame to determine position of a target within the reaction chamber. Semiconductor processing systems and methods of determining position of targets within reaction chambers in semiconductor processing systems are also described.

公开(公告)号：US20230386889A1

公开(公告)日：2023-11-30

申请号：US18448638

申请日：2023-08-11

Applicant: ASM IP Holding, B.V.

Inventor： Saket Rathi ,  Shiva K.T. Rajavelu Muralidhar ,  Siyao Luan ,  Alexandros Demos ,  Xing Lin

IPC: H01L21/687 ,  H01L21/268 ,  H01L21/67 ,  H01L21/324

CPC classification number: H01L21/6875 ,  H01L21/2686 ,  H01L21/67253 ,  H01L21/67115 ,  H01L21/324 ,  H01L21/68735 ,  H01L21/67248

Abstract: A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.

公开(公告)号：US11764101B2

公开(公告)日：2023-09-19

申请号：US17075504

申请日：2020-10-20

Applicant: ASM IP HOLDING B.V.

Inventor： Saket Rathi ,  Shiva K. T. Rajavelu Muralidhar ,  Siyao Luan ,  Alexandros Demos ,  Xing Lin

IPC: H01L21/324 ,  H01L21/687 ,  H01L21/67 ,  H01L21/268 ,  H01L21/683

CPC classification number: H01L21/6875 ,  H01L21/2686 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/67253 ,  H01L21/68735 ,  H01L21/67248

Abstract: A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.

公开(公告)号：US20220181193A1

公开(公告)日：2022-06-09

申请号：US17457605

申请日：2021-12-03

Applicant: ASM IP HOLDING B.V.

Inventor： Peipei Gao ,  Wentao Wang ,  Xing Lin ,  Han Ye ,  Ion Hong Chao ,  Siyao Luan ,  Alexandros Demos ,  Fan Gao

IPC: H01L21/687

Abstract: A substrate support and lift assembly configured to support and lift a substrate from a susceptor is disclosed. The substrate support and lift assembly can include a susceptor support and a lift pin. The susceptor support can be configured to support the susceptor thereon. The susceptor support includes a plurality of support arms each extending radially from a central portion of the susceptor support to a terminus. Each of the plurality of support arms includes an aperture extending therethrough. The lift pin can be configured to fit through the aperture of a corresponding support arm to lift a substrate on the susceptor.

公开(公告)号：US20210125853A1

公开(公告)日：2021-04-29

申请号：US17075504

申请日：2020-10-20

Applicant: ASM IP HOLDING B.V.

Inventor： Saket Rathi ,  Shiva K.T. Rajavelu Muralidhar ,  Siyao Luan ,  Alexandros Demos ,  Xing Lin

IPC: H01L21/687 ,  H01L21/324 ,  H01L21/67 ,  H01L21/268

Abstract: A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.