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公开(公告)号:US11946137B2
公开(公告)日:2024-04-02
申请号:US17549022
申请日:2021-12-13
Applicant: ASM IP Holding B.V.
Inventor: Aniket Nitin Patil , Saket Rathi , Sam Kim , Shiva K. T. Rajavelu Muralidhar
IPC: B23Q3/00 , C23C16/455 , C23C16/458 , C23C16/52
CPC classification number: C23C16/455 , B23Q3/00 , C23C16/4582 , C23C16/52
Abstract: A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about a rotation axis, and is configured to slidably seat a susceptor assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, is radially offset from the rotation axis, and is configured to determine ex-situ runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine ex-situ wobble of the susceptor assembly. Fixture arrangements and methods of determining ex-situ runout and ex-situ wobble of susceptor assemblies for semiconductor processing systems are also described.
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公开(公告)号:USD920936S1
公开(公告)日:2021-06-01
申请号:US29677173
申请日:2019-01-17
Applicant: ASM IP HOLDING B.V.
Designer: Uday Kiran Rokkam , Sam Kim , Saket Rathi , Dakai Bian
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公开(公告)号:USD914620S1
公开(公告)日:2021-03-30
申请号:US29677183
申请日:2019-01-17
Applicant: ASM IP HOLDING B.V.
Designer: Uday Kiran Rokkam , Sam Kim , Saket Rathi , Dakai Bian
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公开(公告)号:USD965044S1
公开(公告)日:2022-09-27
申请号:US29702423
申请日:2019-08-19
Applicant: ASM IP Holding B.V.
Designer: Aniket Patil , Sam Kim , John DiSanto , Saket Rathi
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公开(公告)号:US20240218508A1
公开(公告)日:2024-07-04
申请号:US18609379
申请日:2024-03-19
Applicant: ASM IP Holding B.V.
Inventor: Aniket Nitin Patil , Saket Rathi , Sam Kim , Shiva K.T. Rajavelu Muralidhar
IPC: C23C16/455 , B23Q3/00 , C23C16/458 , C23C16/52
CPC classification number: C23C16/455 , B23Q3/00 , C23C16/4582 , C23C16/52
Abstract: A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about a rotation axis, and is configured to slidably seat a susceptor assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, is radially offset from the rotation axis, and is configured to determine ex-situ runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine ex-situ wobble of the susceptor assembly. Fixture arrangements and methods of determining ex-situ runout and ex-situ wobble of susceptor assemblies for semiconductor processing systems are also described.
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公开(公告)号:USD958764S1
公开(公告)日:2022-07-26
申请号:US29782159
申请日:2021-05-04
Applicant: ASM IP HOLDING B.V.
Designer: Uday Kiran Rokkam , Sam Kim , Saket Rathi , Dakai Bian
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公开(公告)号:US20220186369A1
公开(公告)日:2022-06-16
申请号:US17549022
申请日:2021-12-13
Applicant: ASM IP Holding B.V.
Inventor: Aniket Nitin Patil , Saket Rathi , Sam Kim , Shiva K.T. Rajavelu Muralidhar
IPC: C23C16/455 , C23C16/458 , C23C16/52
Abstract: A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about a rotation axis, and is configured to slidably seat a susceptor assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, is radially offset from the rotation axis, and is configured to determine ex-situ runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine ex-situ wobble of the susceptor assembly. Fixture arrangements and methods of determining ex-situ runout and ex-situ wobble of susceptor assemblies for semiconductor processing systems are also described.
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公开(公告)号:US20240249970A1
公开(公告)日:2024-07-25
申请号:US18627178
申请日:2024-04-04
Applicant: ASM IP Holding B.V.
Inventor: Uday Kiran Rokkam , Sam Kim , Saket Rathi , Dakai Bian
IPC: H01L21/687
CPC classification number: H01L21/68735 , H01L21/6875 , H01L21/68785
Abstract: A susceptor can include a generally circular shape and may include an inner and outer susceptor. The outer susceptor can include a support region having one or more support mechanisms as well as a channel region extending from the region boundary to an outer radial boundary radially inward of an outer edge of the susceptor, the channel region can include a plurality of channels extending radially from the region boundary to the outer radial boundary.
The inner susceptor can include a second plurality of channels extending from the inner radial boundary to an edge of the inner susceptor.-
公开(公告)号:US20230386889A1
公开(公告)日:2023-11-30
申请号:US18448638
申请日:2023-08-11
Applicant: ASM IP Holding, B.V.
Inventor: Saket Rathi , Shiva K.T. Rajavelu Muralidhar , Siyao Luan , Alexandros Demos , Xing Lin
IPC: H01L21/687 , H01L21/268 , H01L21/67 , H01L21/324
CPC classification number: H01L21/6875 , H01L21/2686 , H01L21/67253 , H01L21/67115 , H01L21/324 , H01L21/68735 , H01L21/67248
Abstract: A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.
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公开(公告)号:US11764101B2
公开(公告)日:2023-09-19
申请号:US17075504
申请日:2020-10-20
Applicant: ASM IP HOLDING B.V.
Inventor: Saket Rathi , Shiva K. T. Rajavelu Muralidhar , Siyao Luan , Alexandros Demos , Xing Lin
IPC: H01L21/324 , H01L21/687 , H01L21/67 , H01L21/268 , H01L21/683
CPC classification number: H01L21/6875 , H01L21/2686 , H01L21/324 , H01L21/67115 , H01L21/67253 , H01L21/68735 , H01L21/67248
Abstract: A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.
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