公开(公告)号：US20240213040A1

公开(公告)日：2024-06-27

申请号：US18391815

申请日：2023-12-21

申请人： ASM IP Holding B.V.

发明人： Mun Peow Wong

IPC分类号： H01L21/67

CPC分类号： H01L21/67017 ,  H01L21/67196

摘要： Various embodiments of the present technology may provide an apparatus for removing oxygen and moisture from a semiconductor system. The apparatus may be coupled to a wafer handling chamber and include a blower, a first air purifier, a second air purifier, and a particle filter. The first and second air purifiers may be coupled in parallel to each other and downstream from the blower. The particle filter may be coupled downstream from the first and second air purifiers. The wafer handling chamber may include a fan integrated within a lower region of the wafer handling chamber.

公开(公告)号：US20240249971A1

公开(公告)日：2024-07-25

申请号：US18417655

申请日：2024-01-19

申请人： ASM IP Holding B.V.

发明人： Rohan Vijay Rane ,  Ankit Kimtee ,  Todd Robert Dunn ,  Akshay Phadnis ,  Kyle Fondurulia ,  Sudhanshu Biyani ,  Mun Peow Wong

IPC分类号： H01L21/687

CPC分类号： H01L21/68742

摘要： Weighted lift pin constructions as disclosed may be used with a semiconductor fabrication processing apparatus. The weighted lift pin constructions comprise a lift pin and a weight element disposed along an end of the lift pin. The weight element is removably retained on the lift pin by a retaining element that may be a clip element, an O-ring element, and differently configured lift pin and weight element threaded sections. When the clip element or O-ring element used, the weight element includes a collar adjacent an end of an opening in the weight element to accommodate placement of the clip or O-ring element therein as retained on the lift pin to thereby maintain axial placement of the lift pin relative to the weight element. Such maintained axial placement may also be achieved by interference locked engagement between differently configured lift pin and weighted element threaded sections.

公开(公告)号：US20240312810A1

公开(公告)日：2024-09-19

申请号：US18603366

申请日：2024-03-13

申请人： ASM IP Holding B.V.

发明人： Mun Peow Wong

IPC分类号： H01L21/67 ,  C23C16/455 ,  C23C16/52

CPC分类号： H01L21/6719 ,  C23C16/45565 ,  C23C16/52 ,  H01L21/67017 ,  H01L21/67248

摘要： Enclosure constructions comprise a housing configured to enclose an upper chamber of reactors, associated showerheads, and material source or gas lines of a semiconductor fabrication assembly. A heating element and fan impeller are inside the housing. A motor is disposed outside of the housing and is operatively coupled to the fan impeller. A controller is used to operate one or both of the heating element and the motor to produce heated air that is distributed within the housing. The heated air distributed in the housing has a uniform temperature, minimizes or eliminates the number of heat zones in the assembly, and heats the material source lines to eliminate the need for heating jackets, associated controllers, and associated insulation. The enclosure construction reduces the complexity and spatial packing density of the assembly to facilitate assembly, installation, and maintenance of the assembly, and improves the operating thermal efficiency of the assembly.