公开(公告)号：US20230369073A1

公开(公告)日：2023-11-16

申请号：US18195422

申请日：2023-05-10

申请人： ASM IP Holding B.V.

发明人： Ankit Kimtee ,  Sudhanshu Biyani

IPC分类号： H01L21/67

CPC分类号： H01L21/67017

摘要： Cabinets used in semiconductor fabrication processes comprise a housing with an internal space having a storage vessel disposed therein that contains material used for semiconductor fabrication processing that is maintained at a set temperature. Thermal management systems and devices disclosed herein comprise a thermal insulating material that is disposed on the housing and that is positioned at one or more locations on the cabinet to reduce thermal transfer from an external thermal energy source external from and adjacent the cabinet to the internal space and the storage vessel. Use of the thermal insulating material functions to mitigate or eliminate the unwanted transfer of thermal energy from the external thermal energy source to the storage vessel inside of the cabinet to thereby not influence the set temperature of the storage vessel and its contents to thereby promote the effective and efficient use of the stored material during semiconductor fabrication.

公开(公告)号：US20230287565A1

公开(公告)日：2023-09-14

申请号：US18117514

申请日：2023-03-06

申请人： ASM IP Holding B.V.

发明人： Ankit Kimtee ,  Pawan Sharma ,  Sudhanshu Biyani

IPC分类号： C23C16/448 ,  C23C16/52

CPC分类号： C23C16/448 ,  C23C16/52 ,  H01L21/67248

摘要： A reactor system for use in semiconductor processing that makes use of a liquid source for deposition that needs to be maintained within a specific temperature control band or range. The reactor system includes a temperature control system that includes a heating and cooling apparatus for providing both heating and cooling of a vessel that stores the liquid source to maintain the liquid source within a desired temperature control band or range. In this manner, the heating and cooling apparatus may be used in a reactor system in which the vessel needs to be cooled, needs to be heated, or uses concurrent or alternating heating and cooling to provide enhanced control of the source temperature within a particular temperature control band.

公开(公告)号：US20210340671A1

公开(公告)日：2021-11-04

申请号：US17239768

申请日：2021-04-26

申请人： ASM IP Holding B.V.

发明人： Jianqiu Huang ,  Ankit Kimtee ,  Sudhanshu Biyani ,  Jonathan Robert Bakke ,  Eric James Shero

IPC分类号： C23C16/448 ,  C23C16/44 ,  C23C16/455 ,  C23C16/50

摘要： The present disclosure is generally directed to a solid source precursor delivery system. More specifically, the present disclosure is directed to a solid source precursor vessel that can be utilized to vaporize a supply of solid precursor stored within the vessel. The disclosed source vessel utilizes a plurality of individual cavities or pockets within the interior of the vessel. Each individual pocket may be loaded with precursor. In an arrangement, the pockets may be loaded with pre-formed blocks of compressed precursor material that typically have a higher density than was previously achieved when packing solid precursor within a source vessel. The increased density of the solid precursor material increases a capacity of the source vessel resulting in longer intervals between replacement and/or refilling the source vessel.

公开(公告)号：US20240249971A1

公开(公告)日：2024-07-25

申请号：US18417655

申请日：2024-01-19

申请人： ASM IP Holding B.V.

发明人： Rohan Vijay Rane ,  Ankit Kimtee ,  Todd Robert Dunn ,  Akshay Phadnis ,  Kyle Fondurulia ,  Sudhanshu Biyani ,  Mun Peow Wong

IPC分类号： H01L21/687

CPC分类号： H01L21/68742

摘要： Weighted lift pin constructions as disclosed may be used with a semiconductor fabrication processing apparatus. The weighted lift pin constructions comprise a lift pin and a weight element disposed along an end of the lift pin. The weight element is removably retained on the lift pin by a retaining element that may be a clip element, an O-ring element, and differently configured lift pin and weight element threaded sections. When the clip element or O-ring element used, the weight element includes a collar adjacent an end of an opening in the weight element to accommodate placement of the clip or O-ring element therein as retained on the lift pin to thereby maintain axial placement of the lift pin relative to the weight element. Such maintained axial placement may also be achieved by interference locked engagement between differently configured lift pin and weighted element threaded sections.

公开(公告)号：US20240167160A1

公开(公告)日：2024-05-23

申请号：US18510043

申请日：2023-11-15

申请人： ASM IP Holding B.V.

发明人： Ankit Kimtee ,  Sudhanshu Biyani ,  Kyle Fondurulia ,  Yeonsu Rhee ,  Shubham Garg

IPC分类号： C23C16/455 ,  C23C16/458 ,  C23C16/46

CPC分类号： C23C16/45591 ,  C23C16/4585 ,  C23C16/4586 ,  C23C16/46

摘要： Various embodiments of the present technology may provide a feature to isolate an upper chamber of a reaction chamber from a lower chamber of a reaction chamber. In one case, a susceptor has a groove along an outer edge that is configured to mate with a spacer plate. A seal is disposed in the groove. In another case, a flow control ring, which rests on the susceptor, has a groove along an outer edge that is configured to mate with the spacer plate.

公开(公告)号：US11959168B2

公开(公告)日：2024-04-16

申请号：US17239768

申请日：2021-04-26

申请人： ASM IP Holding B.V.

发明人： Jianqiu Huang ,  Ankit Kimtee ,  Sudhanshu Biyani ,  Jonathan Robert Bakke ,  Eric James Shero

IPC分类号： C23C16/455 ,  C23C16/44 ,  C23C16/448 ,  C23C16/50

CPC分类号： C23C16/448 ,  C23C16/44 ,  C23C16/4408 ,  C23C16/45525 ,  C23C16/50

摘要： The present disclosure is generally directed to a solid source precursor delivery system. More specifically, the present disclosure is directed to a solid source precursor vessel that can be utilized to vaporize a supply of solid precursor stored within the vessel. The disclosed source vessel utilizes a plurality of individual cavities or pockets within the interior of the vessel. Each individual pocket may be loaded with precursor. In an arrangement, the pockets may be loaded with pre-formed blocks of compressed precursor material that typically have a higher density than was previously achieved when packing solid precursor within a source vessel. The increased density of the solid precursor material increases a capacity of the source vessel resulting in longer intervals between replacement and/or refilling the source vessel.