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公开(公告)号:US09960072B2
公开(公告)日:2018-05-01
申请号:US15050159
申请日:2016-02-22
申请人: ASM IP Holding B.V.
发明人: Stephen Dale Coomer
IPC分类号: H01L21/687 , H01L21/68
CPC分类号: H01L21/68742 , H01L21/68 , H01L21/68785 , H01L21/68792
摘要: A vertical adjustment assembly is disclosed in order to provide for matching vertical positions of two substrates within separate chambers or cavities of a reaction system for processing of semiconductor substrates. The vertical adjustment assembly, in cooperation with a main lift driver, can provide for a more accurate positioning of the substrates to account for a tolerance stack-up error.
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公开(公告)号:US20180166315A1
公开(公告)日:2018-06-14
申请号:US15892756
申请日:2018-02-09
申请人: ASM IP Holding B.V.
发明人: Stephen Dale Coomer
IPC分类号: H01L21/687 , H01L21/68
CPC分类号: H01L21/68742 , H01L21/68 , H01L21/68785 , H01L21/68792
摘要: A vertical adjustment assembly is disclosed in order to provide for matching vertical positions of two substrates within separate chambers or cavities of a reaction system for processing of semiconductor substrates. The vertical adjustment assembly, in cooperation with a main lift driver, can provide for a more accurate positioning of the substrates to account for a tolerance stack-up error.
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公开(公告)号:US10312129B2
公开(公告)日:2019-06-04
申请号:US15892756
申请日:2018-02-09
申请人: ASM IP Holding B.V.
发明人: Stephen Dale Coomer
IPC分类号: H01L21/687 , H01L21/68
摘要: A vertical adjustment assembly is disclosed in order to provide for matching vertical positions of two substrates within separate chambers or cavities of a reaction system for processing of semiconductor substrates. The vertical adjustment assembly, in cooperation with a main lift driver, can provide for a more accurate positioning of the substrates to account for a tolerance stack-up error.
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公开(公告)号:US20170260649A1
公开(公告)日:2017-09-14
申请号:US15410503
申请日:2017-01-19
申请人: ASM IP Holding B.V.
发明人: Stephen Dale Coomer , Robert Vyne , Timo Bergman , Lee Bode , Wentao Wang
IPC分类号: C30B25/14 , C23C16/455 , C30B25/16
CPC分类号: C30B25/14 , C23C16/45561 , C23C16/45582 , C23C16/45587 , C30B25/165
摘要: A gas distribution system is disclosed in order to obtain better film uniformity on a wafer. The better film uniformity may be achieved by utilizing an expansion plenum and a plurality of, for example, proportioning valves to ensure an equalized pressure or flow along each gas line disposed above the wafer.
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公开(公告)号:US20170092531A1
公开(公告)日:2017-03-30
申请号:US15050159
申请日:2016-02-22
申请人: ASM IP Holding B.V.
发明人: Stephen Dale Coomer
IPC分类号: H01L21/687
CPC分类号: H01L21/68742 , H01L21/68 , H01L21/68785 , H01L21/68792
摘要: A vertical adjustment assembly is disclosed in order to provide for matching vertical positions of two substrates within separate chambers or cavities of a reaction system for processing of semiconductor substrates. The vertical adjustment assembly, in cooperation with a main lift driver, can provide for a more accurate positioning of the substrates to account for a tolerance stack-up error.
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