公开(公告)号：US09544983B2

公开(公告)日：2017-01-10

申请号：US14533813

申请日：2014-11-05

Applicant: ASML Netherlands B.V.

Inventor： Chirag Rajyaguru ,  John M. Algots ,  Tetsuya Ishikawa ,  Peter Baumgart

IPC: H05G2/00

CPC classification number: H05G2/006 ,  H05G2/008

Abstract: An EUV light source target material handling system is disclosed which includes a target material dispenser and a target material repository in which solid target material in the target material repository is converted to target material in liquid form through the use of inductive heating.

Abstract translation: 公开了一种EUV光源目标材料处理系统，其包括目标材料分配器和目标材料储存库，其中通过使用感应加热将目标材料储存库中的固体目标材料转化为液体形式的目标材料。

公开(公告)号：US09544982B2

公开(公告)日：2017-01-10

申请号：US14169929

申请日：2014-01-31

Applicant: ASML NETHERLANDS B.V.

Inventor： Jian Zhao ,  Tetsuya Ishikawa

IPC: B05B1/00 ,  H05G2/00 ,  B05B1/02 ,  F02M61/18 ,  H01J49/16 ,  B01D15/08 ,  B41J2/16 ,  B05B15/02

CPC classification number: H05G2/006 ,  B01D15/08 ,  B05B1/00 ,  B05B1/02 ,  B05B15/50 ,  B05B15/52 ,  B41J2/162 ,  F02M61/1853 ,  H01J49/165 ,  H05G2/008 ,  Y10S239/19

Abstract: An EUV light source target material handling system is disclosed which includes a target material dispenser and a target material repository including a nozzle with a radial trench design. The nozzle may be formed from a silicon-on-insulator wafer.

Abstract translation: 公开了一种EUV光源目标材料处理系统，其包括目标材料分配器和包括具有径向沟槽设计的喷嘴的目标材料库。 喷嘴可以由绝缘体上硅晶片形成。