公开(公告)号：US11662666B2

公开(公告)日：2023-05-30

申请号：US17441353

申请日：2020-03-05

申请人： ASML NETHERLANDS B.V.

发明人： Rowin Meijerink ,  Putra Saputra ,  Pieter Gerardus Jacobus Smorenberg ,  Theo Wilhelmus Maria Thijssen ,  Khalid Elbattay ,  Ma Su Su Hlaing ,  Paul Derwin ,  Bo Zhong ,  Masaya Komatsu

IPC分类号： G03F7/20

CPC分类号： G03F7/70633 ,  G03F7/70258 ,  G03F7/70725

摘要： A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.

公开(公告)号：US09939738B2

公开(公告)日：2018-04-10

申请号：US15329536

申请日：2015-07-16

申请人： ASML Netherlands B.V.

发明人： Adrianus Hendrik Koevoets ,  Christianus Wilhelmus Johannes Berendsen ,  Rogier Hendrikus Magdalena Cortie ,  Jim Vincent Overkamp ,  Patricius Jacobus Neefs ,  Putra Saputra ,  Ruud Hendrikus Martinus Johannes Bloks ,  Michael Johannes Hendrika Wilhelmina Renders ,  Johan Gertrudis Cornelis Kunnen ,  Thibault Simon Mathieu Laurent

IPC分类号： G03F7/20

CPC分类号： G03F7/70725 ,  G03F7/70341 ,  G03F7/70783 ,  G03F7/70875

摘要： A lithographic apparatus comprising an object table which carries an object. The lithographic apparatus may further comprise at least one sensor as part of a measurement system to measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimate the deformation of the object due to varying loads during operation of the lithographic apparatus, for example varying loads induced by a two-phase flow in a channel formed within the object table. Additionally, or alternatively, the lithographic apparatus comprises a predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation. The positioning of a projection beam, used to pattern a substrate, can be controlled relative to the object, to alter the position of the pattern and/or the projection beam on the substrate, based on the estimated deformation.

公开(公告)号：USRE49142E1

公开(公告)日：2022-07-19

申请号：US16590895

申请日：2019-10-02

申请人： ASML Netherlands B.V.

发明人： Adrianus Hendrik Koevoets ,  Christianus Wilhelmus Johannes Berendsen ,  Rogier Hendrikus Magdalena Cortie ,  Jim Vincent Overkamp ,  Patricius Jacobus Neefs ,  Putra Saputra ,  Ruud Hendrikus Martinus Johannes Bloks ,  Michael Johannes Hendrika Wilhelmina Renders ,  Johan Gertrudis Cornelis Kunnen ,  Thibault Simon Mathieu Laurent

IPC分类号： G03F7/20

摘要： A lithographic apparatus comprising includes an object table which carries an object. The lithographic apparatus may further comprise at least one include a sensor as part of a measurement system to measure a characteristic of the object table, the environment surrounding the lithographic apparatus or another component of the lithographic apparatus. The measured characteristic may be used to estimate the a deformation of the an object due to a varying loads load during operation of the lithographic apparatus, for example a varying loads load induced by a two-phase flow in a channel formed within of the object table. Additionally, or alternatively, the The lithographic apparatus comprises may include a predictor to estimate the deformation of the object based on a model. The positioning of the object table carrying the object can be controlled based on the estimated deformation. The positioning of a projection beam, used to provide a pattern a substrate, can be controlled relative to the object, to alter the position of the pattern and/or the projection beam on the substrate, based on the estimated deformation.