公开(公告)号：US20200080902A1

公开(公告)日：2020-03-12

申请号：US16557024

申请日：2019-08-30

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ji-Kuang TAN ,  Wei-Ming CHEN ,  Chen-Wei FAN ,  Teng-Liang NG

IPC: G01K7/42 ,  G06F1/20 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/30

Abstract: A temperature control system, adapted to a central processing unit powered by a power supply module of an electronic device, is provided. The temperature control system includes a setting module, a first temperature detecting module, a second temperature detecting module, and a power adjusting module. The setting module is configured to set a target temperature of the CPU and a target temperature of the power supply module. The first temperature detecting module is configured to obtain a detected temperature of the CPU. The second temperature detecting module is electrically connected to the power supply module, to obtain a detected temperature of the power supply module. The power adjusting module is configured to adjust a control parameter of the CPU or the power supply module based on a first temperature difference between the target temperature of the CPU and the detected temperature of the CPU or a second temperature difference between the target temperature of the power supply module and the detected temperature of the power supply module.

公开(公告)号：US20180139845A1

公开(公告)日：2018-05-17

申请号：US15813246

申请日：2017-11-15

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bing-Min LIN ,  Teng-Liang NG ,  Ji-Kuang TAN ,  Ming-Fang TSAI ,  Chih-Kuang LIN

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  G08B5/38

CPC classification number: H05K1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F11/3058 ,  G06F11/325 ,  G08B5/38 ,  H05K1/0274 ,  H05K1/18 ,  H05K7/20172 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A motherboard is provided. The motherboard includes a main body, a notch formed at a side edge of the main body, and a fixing device formed adjacent to the notch to fix an auxiliary device. The function of the motherboard is expanded significantly while artistic of the appearance of the motherboard is improved.

公开(公告)号：US20200233477A1

公开(公告)日：2020-07-23

申请号：US16596480

申请日：2019-10-08

Applicant: ASUSTEK COMPUTER INC.

Inventor： Teng-Liang NG ,  Ji-Kuang TAN ,  Bing-Min LIN ,  Chen-Wei FAN

IPC: G06F1/324

Abstract: A computer system management method including the following steps is provided. First, a target value and at least one input parameter are set. The target value and the at least one input parameter are related to at least one of a first data type and a second data type, and the first data type is related to the second data type. Then, a first algorithm is determined based on a third data type, and an input value of the third data type is calculated by using the first algorithm. The third data type is related to the first data type and the second data type. Afterward, a second algorithm is determined based on the target value, the at least one input parameter, and the input value, and an estimated value of the second data type is calculated by using the second algorithm. A computer system is also provided.

公开(公告)号：US20130094130A1

公开(公告)日：2013-04-18

申请号：US13627459

申请日：2012-09-26

Applicant: ASUSTeK Computer Inc.

Inventor： Shang-Li YANG ,  Ji-Kuang TAN ,  Bing-Min LIN

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/02 ,  G06F1/16

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A mother board comprises a circuit board, an electronic device, and a fixing module. The circuit board includes a first surface, a second surface, a plurality of first fixing holes, and a plurality of second fixing holes. The electronic device is disposed on the first surface. The fixing module includes an upper casing, a first back casing, and a second back casing. The upper casing is disposed on the first surface and includes a plurality of holes. The first back casing is disposed on the second surface and includes a plurality of first fixing elements which are passed through the first fixing holes to connect to the holes of the upper casing. The second back casing is disposed on the second surface and includes a plurality of second fixing elements which are connected to the second fixing holes.

Abstract translation: 母板包括电路板，电子设备和固定模块。 电路板包括第一表面，第二表面，多个第一固定孔和多个第二固定孔。 电子设备设置在第一表面上。 固定模块包括上壳体，第一后壳体和第二后壳体。 上壳体设置在第一表面上并且包括多个孔。 第一后壳体设置在第二表面上，并且包括多个第一固定元件，第一固定元件穿过第一固定孔以连接到上壳体的孔。 第二后壳体设置在第二表面上，并且包括连接到第二固定孔的多个第二固定元件。