公开(公告)号：US10949631B1

公开(公告)日：2021-03-16

申请号：US16672894

申请日：2019-11-04

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Kimmo Kyllonen

IPC: G06K7/10 ,  H01Q21/28

Abstract: A disclosed transponder arrangement includes a transponder integrated circuit (IC), an inductive loop, and a dipole antenna. First and second wires are coupled to the transponder IC and have portions configured for different levels of electrical coupling between one another. Engagement of the inductive loop with an induction portion of the dipole antenna induces current flow in the inductive loop in response to the dipole antenna resonating from a radio frequency (RF) signal, and disengagement makes the transponder IC non-responsive to the RF signal. Depending on a level of electrical coupling between the first and second wires, the transponder IC generates an RF signal that encodes either a first value indicating partial engagement or a second value indicating full engagement in response to the current flow in the inductive loop.

公开(公告)号：US10398873B1

公开(公告)日：2019-09-03

申请号：US16041392

申请日：2018-07-20

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Kimmo Kyllonen ,  David Neuman ,  Scott Lindblad

IPC: A61M25/00 ,  H01F7/06 ,  H02G3/04

Abstract: A disclosed cable includes a roll of flexible substrate. The substrate has opposing first and second surfaces and the roll is structured around an axis. A plurality of electrically conductive wires are attached to the first surface of the substrate, and the roll of flexible substrate and attached plurality of wires have alternating layers of wires and substrate.

公开(公告)号：US10169697B1

公开(公告)日：2019-01-01

申请号：US15690453

申请日：2017-08-30

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Kimmo Kyllonen

IPC: G06K19/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00

Abstract: A disclosed RF tag includes a substrate and an integrated circuit (IC) package disposed on the substrate. The IC package has an integrated antenna element coupled to circuitry of the IC package. The RF tag also includes an external antenna element of round wire having at least one half turn disposed against two or more surfaces of the IC package. The external antenna element is inductively coupled to the integrated antenna element, and the IC package laterally supports the at least one half turn of the external antenna element.

公开(公告)号：US10171133B1

公开(公告)日：2019-01-01

申请号：US15900220

申请日：2018-02-20

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Kimmo Kyllonen

IPC: H04B5/00

Abstract: A transponder arrangement includes a substrate, an RF transponder, and first, second, and third antenna elements. The substrate has a first surface and an opposing second surface. The RF transponder is disposed on the first surface of the substrate and has a first connection pad and a second connection pad. The first antenna element is disposed on the first surface of the substrate and is connected to the first connection pad. The second antenna element is disposed on the first surface of the substrate and is connected to the second connection pad. The third antenna element is disposed on the second surface of the substrate and is inductively coupled to the first and second antenna elements.

公开(公告)号：US11423240B1

公开(公告)日：2022-08-23

申请号：US17116485

申请日：2020-12-09

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Kimmo Kyllonen

IPC: G06K7/10 ,  G06K19/07

Abstract: A transponder arrangement includes a flexible substrate having a first portion configured to engage a first structure and a second portion configured to engage a second structure, and a transponder integrated circuit (IC). Detection wiring is disposed on the first portion of the flexible substrate and coupled to the transponder IC, and an antenna disposed on the second portion of the flexible substrate and coupled to the transponder IC. The transponder IC is configured to generate an RF data signal that encodes different data values in response to the antenna resonating and different electricity levels on the detection wiring.

公开(公告)号：US11144809B1

公开(公告)日：2021-10-12

申请号：US16893042

申请日：2020-06-04

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Kimmo Kyllonen

IPC: G06K19/077 ,  G06K19/07

Abstract: A transponder arrangement includes a frame and a RF transponder tag. The frame has a transponder bed. A raised edge at least partially surrounds the transponder bed and forms a recessed surface on the transponder bed. The frame includes a plurality of support members attached to the transponder bed. The support members provide a ventilated air-space and separation between the transponder bed and surfaces for attachment to the target article. The RF transponder tag is attached to the frame on the recessed surface of the transponder bed.

公开(公告)号：US10381325B1

公开(公告)日：2019-08-13

申请号：US15668870

申请日：2017-08-04

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Kimmo Kyllonen ,  Robert Neuman

IPC: H01L23/52 ,  H01L23/00 ,  B23K20/00

Abstract: A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.