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公开(公告)号：US20210184327A1
公开(公告)日：2021-06-17
申请号：US17190776
申请日：2021-03-03
Applicant: AVX Corporation
Inventor： Arie Leonid Talalaevsky , Michael Marek , Elinor O'Neill
Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.
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公开(公告)号：US20190280361A1
公开(公告)日：2019-09-12
申请号：US16287089
申请日：2019-02-27
Applicant: AVX Corporation
Inventor： Arie Leonid Talalaevsky , Michael Marek , Elinor O'Neill
Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.
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公开(公告)号：US10944147B2
公开(公告)日：2021-03-09
申请号：US16287089
申请日：2019-02-27
Applicant: AVX Corporation
Inventor： Arie Leonid Talalaevsky , Michael Marek , Elinor O'Neill
Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.
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公开(公告)号：US11652265B2
公开(公告)日：2023-05-16
申请号：US17190776
申请日：2021-03-03
Applicant: AVX Corporation
Inventor： Arie Leonid Talalaevsky , Michael Marek , Elinor O'Neill
CPC classification number: H01P5/184 , H01P3/081 , H01P5/12 , H01P11/003 , H05K1/0237 , H05K1/115 , H04W88/08 , H05K2201/10098
Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about −30 dB at about 28 GHz.
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