公开(公告)号：US20250028241A1

公开(公告)日：2025-01-23

申请号：US18589501

申请日：2024-02-28

Applicant: Board of Regents, The University of Texas System ,  c/o Adaptive 3D Technologies, LLC

Inventor： Benjamin LUND ,  Jesse HUFFSTETLER ,  Daniel ZAMORANO ,  Sushanta DAS ,  Crystal NIERMANN ,  Caleb LUND ,  Amy NGUYEN ,  Yili WU ,  Walter VOIT

IPC: G03F7/00 ,  B33Y70/00 ,  B33Y70/10 ,  B33Y80/00 ,  C08F2/44 ,  C08F220/18 ,  C08F220/56 ,  C08F222/08 ,  G03F7/004 ,  G03F7/027 ,  G03F7/029 ,  G03F7/105

Abstract: The present disclosure relates to thiol-acrylate photopolymerizable resin compositions. The resin compositions may be used for additive manufacturing. One embodiment of the invention includes a photopolymerizable resin for additive manufacturing in an oxygen environment, the resin comprising: a crosslinking component; at least one monomer and/or oligomer; and a chain transfer agent comprising at least one of a thiol, a secondary alcohol, and/or a tertiary amine, wherein the resin may be configured to react by exposure to light to form a cured material.

公开(公告)号：US20220356363A1

公开(公告)日：2022-11-10

申请号：US17629131

申请日：2020-07-23

Applicant: Adaptive 3D Technologies, LLC

Inventor： Benjamin R. Lund ,  Jesse HUFFSTETLER

IPC: C09D11/101 ,  C09D11/107 ,  C09D11/037 ,  B33Y70/00

Abstract: The present disclosure relates to thiol-acrylate photopolymerizable resin compositions. The resin compositions may be used for additive manufacturing. One embodiment of the invention includes a photopolymerizable resin for additive manufacturing, the resin comprising: an acrylate oligomer; a methacrylate monomer; and a thiol wherein the resin may be configured to react by exposure to light to form a cured material. The resin may further comprise one or more oligomeric additives. For example, polyether oligomeric additives such as polytetrahydrofuran.