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公开(公告)号：US20170220022A1
公开(公告)日：2017-08-03
申请号：US15010965
申请日：2016-01-29
Applicant: Advanced Micro Devices, Inc.
Inventor： Can Hankendi , Manish Arora , Indrain Paul , Wei Huang , Srilatha Manne
IPC: G05B19/404
CPC classification number: G06F1/206
Abstract: A processing system includes one or more processing units to perform operations and one or more sensors to measure a temperature concurrently with the one or more processing units performing the operations. The processing system also includes a controller to receive feedback indicating the temperature and to determine a peak temperature and a thermal time constant for heating of the processing system based on a comparison of the measured temperature to a first temperature that is predicted based on the peak temperature and a previously determined thermal time constant for heating. Some embodiments of the controller can control a performance state of the processing system based on the peak temperature and the thermal time constant for heating of the processing system.
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公开(公告)号：US10281964B2
公开(公告)日：2019-05-07
申请号：US15010965
申请日：2016-01-29
Applicant: Advanced Micro Devices, Inc.
Inventor： Can Hankendi , Manish Arora , Indrain Paul , Wei Huang , Srilatha Manne
Abstract: A processing system includes one or more processing units to perform operations and one or more sensors to measure a temperature concurrently with the one or more processing units performing the operations. The processing system also includes a controller to receive feedback indicating the temperature and to determine a peak temperature and a thermal time constant for heating of the processing system based on a comparison of the measured temperature to a first temperature that is predicted based on the peak temperature and a previously determined thermal time constant for heating. Some embodiments of the controller can control a performance state of the processing system based on the peak temperature and the thermal time constant for heating of the processing system.
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