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公开(公告)号：US11830747B2
公开(公告)日：2023-11-28
申请号：US16228407
申请日：2018-12-20
发明人： Kui Zhao , Hiroshi Iizuka
IPC分类号： H01L21/67 , H05H1/46 , H01J37/32 , H01L21/683
CPC分类号： H01L21/67069 , H01J37/32155 , H01J37/32174 , H01J37/32577 , H01J37/32706 , H01L21/6719 , H01L21/67109 , H01L21/6831 , H05H1/46 , H05H1/466 , H05H1/4652 , H05H2242/20
摘要： The present disclosure provides a plasma reactor having a function of tuning low frequency RF power distribution, comprising: a reaction chamber in which an electrically conductive base is provided, the electrically conductive base being connected to a low frequency RF source via a first match, an electrostatic chuck being provided on the electrically conductive base, an upper surface of the electrostatic chuck being configured for fixing a to-be-processed substrate, an outer sidewall of the electrically conductive base being coated with at least one layer of plasma corrosion-resistance dielectric layer, a coupling ring made of a dielectric material surrounding an outer perimeter of the base, a focus ring being disposed above the coupling ring, the focus ring being arranged surround the electrostatic chuck and be exposed to a plasma during a plasma processing procedure; the plasma reactor further comprising an annular electrode that is disposed above the coupling ring but below the focus ring; a wire, a first end of which is electrically connected to the base, and a second end of which is connected to the annular electrode, a variable capacitance being serially connected to the wire.
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公开(公告)号：US10685811B2
公开(公告)日：2020-06-16
申请号：US16387438
申请日：2019-04-17
发明人： Kui Zhao , Hiroshi Iizuka , Tuqiang Ni , Xiaobei Pang
摘要： A switchable matching network and an inductively coupled plasma processing apparatus having such network are disclosed. The switchable matching network enables selection between two bias power frequencies. The network is particularly suitable for an inductively-coupled plasma processing apparatus. The switchable matching network comprises: a first match circuit having a first input port connected to a first signal source and a first output port coupled to a load; a second match circuit having a second input port connected to a second signal source and a second output port coupled to the load; a switching device having a first connection port, a second connection port and a third connection port, the first connection port connected to the first input port and the second connection port connected to the second output port; a variable capacitor connected between ground and the third connection port of the switching device.
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3.发明申请公开(公告)号：US20200090908A1
公开(公告)日：2020-03-19
申请号：US16387438
申请日：2019-04-17
发明人： Kui Zhao , Hiroshi Iizuka , Tuqiang Ni , Xiaobei Pang
摘要： A switchable matching network and an inductively coupled plasma processing apparatus having such network are disclosed. The switchable matching network enables selection between two bias power frequencies. The network is particularly suitable for an inductively-coupled plasma processing apparatus. The switchable matching network comprises: a first match circuit having a first input port connected to a first signal source and a first output port coupled to a load; a second match circuit having a second input port connected to a second signal source and a second output port coupled to the load; a switching device having a first connection port, a second connection port and a third connection port, the first connection port connected to the first input port and the second connection port connected to the second output port; a variable capacitor connected between ground and the third connection port of the switching device.
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4.发明申请公开(公告)号：US20200211873A1
公开(公告)日：2020-07-02
申请号：US16725947
申请日：2019-12-23
发明人： Kui Zhao , Hiroshi Iizuka , Dee Wu , Razon Zuo , Tuqiang Ni
IPC分类号： H01L21/67 , H01J37/32 , H05B1/02 , H01L21/683
摘要： Disclosed are a temperature control apparatus for semiconductor processing equipment and a corresponding temperature control method, wherein each heating element in each row or each column in a heating element matrix forms a power return circuit with a same power source, respectively, and a same switch module is provided for the power return circuits of all heating elements in each column or each row of the heating element matrix; the input powers to the heating elements in an entire row or column controlled by each power output port of the power source are adjusted by adjusting the output power magnitude of the corresponding power source, and conduction/disconnection of the power return circuits of an entire column or row controlled by each switch module is controlled by controlling ON/OFF of each switch module. The present disclosure reduces circuit complexity and saves costs; the present disclosure reduces temperature control complexity while guaranteeing temperature control accuracy, thereby achieving a uniform and flexible temperature control result.
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