公开(公告)号：US10332849B2

公开(公告)日：2019-06-25

申请号：US16121467

申请日：2018-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao ,  Chih-Yi Huang ,  Fu-Chen Chu

IPC: H01L43/02 ,  H01L23/66 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H01L25/16

Abstract: A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.

公开(公告)号：US11328999B2

公开(公告)日：2022-05-10

申请号：US16706533

申请日：2019-12-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Fu-Chen Chu ,  Hung-Chun Kuo ,  Chen-Chao Wang

IPC: H01L23/538 ,  H01L23/552 ,  H01L23/00

Abstract: A semiconductor device package includes a lower-density substrate and a higher-density substrate. The higher-density substrate is attached to the lower-density substrate. The higher-density substrate has a first interconnection layer and a second interconnection layer disposed over the first interconnection layer. A thickness of the first interconnection layer is different from a thickness of the second interconnection layer.

公开(公告)号：US10074622B2

公开(公告)日：2018-09-11

申请号：US15425723

申请日：2017-02-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh ,  Jen-Chieh Kao ,  Chih-Yi Huang ,  Fu-Chen Chu

IPC: H01L23/49 ,  H01L43/02 ,  H01L23/66 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L43/02 ,  H01L2223/6605 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107

Abstract: A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. The first package body encapsulates the first surface of the substrate. The permeable element includes a first portion disposed on the first surface of the substrate and a second portion disposed on the package body. The coil is within the first package body.