公开(公告)号：US09219048B2

公开(公告)日：2015-12-22

申请号：US14304528

申请日：2014-06-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yun-Hsiang Tien ,  Yi-Chuan Ding

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/14104 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00

Abstract: The present disclosure provides a substrate and a semiconductor package. The substrate includes a body, at least one pad group, a plurality of traces and at least one pillar group. The pad group includes a plurality of pads. Each pad has at least one inner side and at least one outer side. The inner side of a first pad is faced to the inner side of an adjacent second pad with a spaced section between. Each pillar group includes a plurality of pillars disposed on respective ones of the pads. The use of pad groups having multiple pads on which to form pillars allows an increase in the number of the pillars available in a given area so as to increase the amount of I/O connections. Furthermore, for a given number of I/O connections, the area occupied by the pads, pillars and traces can be reduced.

Abstract translation: 本公开提供了一种基板和半导体封装。 衬底包括主体，至少一个衬垫组，多个迹线和至少一个支柱组。 垫组包括多个垫。 每个垫具有至少一个内侧和至少一个外侧。 第一垫的内侧面相邻的第二垫的内侧，其间具有间隔开的部分。 每个支柱组包括设置在各个垫上的多个支柱。 使用具有多个焊盘以形成支柱的焊盘组允许增加给定区域中可用的支柱数量，以增加I / O连接量。 此外，对于给定数量的I / O连接，可以减少由焊盘，柱和迹线占据的面积。

公开(公告)号：US11670836B2

公开(公告)日：2023-06-06

申请号：US17084487

申请日：2020-10-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ting Ruei Chen ,  Hung-Hsiang Cheng ,  Guo-Cheng Liao ,  Yun-Hsiang Tien

IPC: H01Q1/22 ,  H01Q1/36 ,  H01L23/66 ,  H01L23/538 ,  H01Q19/10

CPC classification number: H01Q1/2283 ,  H01L23/5385 ,  H01L23/66 ,  H01Q1/36 ,  H01Q19/104 ,  H01L2924/1421

Abstract: A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.