公开(公告)号：US20240243086A1

公开(公告)日：2024-07-18

申请号：US18098395

申请日：2023-01-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Sheng-Hsiang HSU ,  Cheng-Hung KO ,  Jan-Feng YEN

IPC: H01L23/00 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/13 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H05K1/181 ,  H05K3/3405 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/13014 ,  H01L2224/13021 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/13181 ,  H01L2224/13541 ,  H01L2224/1355 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/16507 ,  H10B80/00

Abstract: An electronic device is disclosed. The electronic device includes a chip, a component, and a plurality of first interlayer elements. The chip has an upper surface and a first pad disposed over the upper surface. The component is disposed over the electronic component and configured to filter noise from the electronic component. The plurality of first interlayer elements connect the first pad. At least one of the plurality of the first interlayer elements is non-overlapping with the component in a direction substantially perpendicular to the upper surface of the component