公开(公告)号：US20190122969A1

公开(公告)日：2019-04-25

申请号：US16156991

申请日：2018-10-10

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Hui Hua LEE ,  Hui-Ying HSIEH ,  Cheng-Hung KO ,  Chi-Tsung CHIU

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

摘要： A semiconductor device package includes a metal carrier, a passive device, a conductive adhesive material, a dielectric layer and a conductive via. The metal carrier has a first conductive pad and a second conductive pad spaced apart from the first conductive pad. The first conductive pad and the second conductive pad define a space therebetween. The passive device is disposed on top surfaces of first conductive pad and the second conductive pad. The conductive adhesive material electrically connects a first conductive contact and a second conductive contact of the passive device to the first conductive pad and the second conductive pad respectively. The dielectric layer covers the metal carrier and the passive device and exposes a bottom surface of the first conductive pad and the second conductive pad. The conductive via extends within the dielectric layer and is electrically connected to the first conductive pad and/or the second conductive pad.

公开(公告)号：US20240243086A1

公开(公告)日：2024-07-18

申请号：US18098395

申请日：2023-01-18

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Sheng-Hsiang HSU ,  Cheng-Hung KO ,  Jan-Feng YEN

IPC分类号： H01L23/00 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H05K1/181 ,  H05K3/3405 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/13014 ,  H01L2224/13021 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/13181 ,  H01L2224/13541 ,  H01L2224/1355 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/16507 ,  H10B80/00

摘要： An electronic device is disclosed. The electronic device includes a chip, a component, and a plurality of first interlayer elements. The chip has an upper surface and a first pad disposed over the upper surface. The component is disposed over the electronic component and configured to filter noise from the electronic component. The plurality of first interlayer elements connect the first pad. At least one of the plurality of the first interlayer elements is non-overlapping with the component in a direction substantially perpendicular to the upper surface of the component