公开(公告)号：US20220404908A1

公开(公告)日：2022-12-22

申请号：US17352125

申请日：2021-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Hui-Chung LIU ,  I Hung WU ,  Kai-Sheng PAI

IPC: G06F3/01 ,  H01Q1/27 ,  G06K19/077 ,  G01S13/75

Abstract: The present disclosure provides a body-part tracking device and a body-part tracking method. The body-part tracking device includes a first electronic component and a first antenna element. The first antenna element is electrically connected to the first electronic component and configured to receive a first wave. The first electronic component is configured to, in response to the first wave, transmit a second wave.

公开(公告)号：US20240339383A1

公开(公告)日：2024-10-10

申请号：US18132351

申请日：2023-04-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ko-Pu WU ,  Chih-Hung HSU ,  Chin Li HUANG ,  Chieh-Yin LIN ,  Yuan-Chun CHEN ,  Kai-Sheng PAI

IPC: H01L23/495

CPC classification number: H01L23/49548 ,  H01L23/3121 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29193 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/73265

Abstract: An electronic device and a method of manufacturing an electronic device are provided. The electronic device includes an electronic component, a carrier, and a lead. The electronic component has a lateral surface. The carrier supports the electronic component. The lead is electrically connected to the electronic component and disposed adjacent to the lateral surface of the electronic component. The carrier and the lead are configured to block an electromagnetic wave between the electronic component and an external of the electronic device.