公开(公告)号：US20240329387A1

公开(公告)日：2024-10-03

申请号：US18127622

申请日：2023-03-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Jr-Wei LIN ,  Pei-Jung YANG

IPC: G02B26/08

CPC classification number: G02B26/0816

Abstract: An optical package is provided. The optical package includes a first optical device and an optical guiding structure. The first optical device is disposed over a carrier. The optical guiding structure is disposed over the carrier and configured to adjust a first optical transmission path of the first optical device.

公开(公告)号：US20250155656A1

公开(公告)日：2025-05-15

申请号：US18506094

申请日：2023-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Pei-Jung YANG

IPC: G02B6/42 ,  H01S5/00 ,  H01S5/02315

Abstract: An optoelectronic structure is provided. The optoelectronic structure includes a carrier, a first optical component, and a second optical component. The first optical component is supported by the carrier. The second optical component is supported by the first optical component and optically coupled to the first optical component.

公开(公告)号：US20250098378A1

公开(公告)日：2025-03-20

申请号：US18369107

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pei-Jung YANG ,  Jr-Wei LIN ,  Mei-Ju LU ,  Chi-Han CHEN

IPC: H01L33/58 ,  H01L25/075 ,  H01L25/16

Abstract: A method for manufacturing an optoelectronic structure and a package structure are provided. The method includes providing a substrate and a light source module and a photonic component over the substrate; and adjusting a lens structure to a unit specific position related to the substrate to couple an optical signal from the light source module to the photonic component.

公开(公告)号：US20210126425A1

公开(公告)日：2021-04-29

申请号：US16663091

申请日：2019-10-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu LIN ,  Chi-Han CHEN ,  Pei-Jung YANG

IPC: H01S5/022 ,  G02B6/12 ,  H01S5/028 ,  H01S5/024

Abstract: An optoelectronic package includes a substrate having a first surface and a second surface opposite to the first surface, an optoelectronic device on the first surface of the substrate, and a first conductive through via connecting the first surface and the second surface of the substrate. The optoelectronic device is electrically connected to the first conductive through via. A method for manufacturing the optoelectronic package is also provided.