公开(公告)号：US20170082485A1

公开(公告)日：2017-03-23

申请号：US15267028

申请日：2016-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen CHIANG ,  Hsin-Ying HO ,  Hsun-Wei CHAN ,  Lu-Ming LAI

IPC: G01J1/04 ,  F21V5/04 ,  F21V17/10 ,  H01L25/16 ,  H01L33/54 ,  H01L33/58 ,  H01L31/0232 ,  G01J1/44 ,  H01L31/0203

CPC classification number: G01J1/0411 ,  G01J1/42 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/02327 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.

公开(公告)号：US20210210662A1

公开(公告)日：2021-07-08

申请号：US16734046

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen CHIANG ,  Kuang-Hsiung CHEN ,  Lu-Ming LAI ,  Hsun-Wei CHAN ,  Hsin-Ying HO ,  Shih-Chieh TANG

IPC: H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.