-
公开(公告)号：US11567119B2
公开(公告)日：2023-01-31
申请号：US17531649
申请日：2021-11-19
发明人： Samer Kabbani , Paul Ferrari , Ikeda Hiroki , Kiyokawa Toshiyuki , Gregory Cruzan , Karthik Ranganathan , Todd Berk , Ian Williams , Mohammad Ghazvini , Thomas Jones
摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.
-
公开(公告)号：US20240183898A1
公开(公告)日：2024-06-06
申请号：US18440226
申请日：2024-02-13
发明人： Karthik Ranganathan , Aritomo Kikuchi , Merlin Wallner , Rajan Surve , Samer Kabbani , Paul Ferrari , Ikeda Hiroki , Kiyokawa Toshiyuki , Gregory Cruzan , Todd Berk , Ian Williams , Mohammad Ghazvini , Thomas Jones
CPC分类号： G01R31/2875 , G01R1/0458 , G01R31/2863 , G01R31/2867 , G01R31/2874
摘要： An active thermal interposer (ATI) device for use in testing integrated circuit device under test (DUT) having thermal isolation structures. The ATI device includes a formation having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the formation, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the formation is disposed adjacent to an interface surface of the DUT during testing of the DUT. The ATI device includes a plurality of thermal resistance structures configured to resist thermal conductance between the plurality of heating zones.
-
公开(公告)号：US20240003967A1
公开(公告)日：2024-01-04
申请号：US18204309
申请日：2023-05-31
发明人： Samer Kabbani , Paul Ferrari , Ikeda Hiroki , Kiyokawa Toshiyuki , Gregory Cruzan , Karthik Ranganathan , Todd Berk , Ian Williams , Mohammad Ghazvini , Thomas Jones
CPC分类号： G01R31/2875 , G01R31/2867 , G01R31/2863 , G01R1/0458 , G01R31/2874
摘要： A stand-alone active thermal interposer device for use in testing an unpackaged integrated circuit device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.
-
公开(公告)号：US20230143240A1
公开(公告)日：2023-05-11
申请号：US17520202
申请日：2021-11-05
发明人： Gregory Cruzan , Karthik Ranganathan , Mohammad Ghazvini , Paul Ferrari , Samer Kabbani , Todd Berk , Thomas Jones
IPC分类号： G01R31/28
CPC分类号： G01R31/2877 , G01R31/2879
摘要： Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.
-
公开(公告)号：US11846669B2
公开(公告)日：2023-12-19
申请号：US17841471
申请日：2022-06-15
发明人： Samer Kabbani , Paul Ferrari , Ikeda Hiroki , Kiyokawa Toshiyuki , Gregory Cruzan , Karthik Ranganathan , Todd Berk , Ian Williams , Mohammad Ghazvini , Thomas Jones
CPC分类号： G01R31/2875 , G01R1/0458 , G01R31/2863 , G01R31/2867 , G01R31/2874
摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.
-
公开(公告)号：US11609266B2
公开(公告)日：2023-03-21
申请号：US17531638
申请日：2021-11-19
发明人： Samer Kabbani , Paul Ferrari , Ikeda Hiroki , Kiyokawa Toshiyuki , Gregory Cruzan , Karthik Ranganathan , Todd Berk , Ian Williams , Mohammad Ghazvini , Thomas Jones
摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.016 秒)
