公开(公告)号：US11774492B2

公开(公告)日：2023-10-03

申请号：US17841491

申请日：2022-06-15

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Tom Jones

IPC分类号： G01R31/28 ,  G01R1/04

CPC分类号： G01R31/2875 ,  G01R1/0458 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2874

摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US11549981B2

公开(公告)日：2023-01-10

申请号：US17479998

申请日：2021-09-20

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Kazuyuki Yamashita ,  Hiroki Ikeda ,  Ira Leventhal ,  Mohammad Ghazvini ,  Paul Ferrari ,  Karthik Ranganathan ,  Gregory Cruzan ,  Gilberto Oseguera

IPC分类号： G01R31/28

摘要： An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

公开(公告)号：US11940487B2

公开(公告)日：2024-03-26

申请号：US18094899

申请日：2023-01-09

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Kazuyuki Yamashita ,  Ikeda Hiroki ,  Ira Leventhal ,  Mohammad Ghazvini ,  Paul Ferrari ,  Karthik Ranganathan ,  Gregory Cruzan ,  Gilberto Oseguera

IPC分类号： G01R31/28

CPC分类号： G01R31/2891 ,  G01R31/2875 ,  G01R31/2877 ,  G01R31/2889

摘要： An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

公开(公告)号：US11846669B2

公开(公告)日：2023-12-19

申请号：US17841471

申请日：2022-06-15

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Thomas Jones

IPC分类号： G01R31/28 ,  G01R1/04

CPC分类号： G01R31/2875 ,  G01R1/0458 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2874

摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US20230228812A1

公开(公告)日：2023-07-20

申请号：US18094899

申请日：2023-01-09

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Kazuyuki Yamashita ,  Hiroki Ikeda ,  Ira Leventhal ,  Mohammad Ghazvini ,  Paul Ferrari ,  Karthik Ranganathan ,  Gregory Cruzan ,  Gilberto Oseguera

IPC分类号： G01R31/28

CPC分类号： G01R31/2891 ,  G01R31/2875 ,  G01R31/2877 ,  G01R31/2889

摘要： An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

公开(公告)号：US11656273B1

公开(公告)日：2023-05-23

申请号：US17520202

申请日：2021-11-05

申请人： Advantest Test Solutions, Inc.

发明人： Gregory Cruzan ,  Karthik Ranganathan ,  Mohammad Ghazvini ,  Paul Ferrari ,  Samer Kabbani ,  Todd Berk

IPC分类号： G01R31/28

CPC分类号： G01R31/2877 ,  G01R31/2879

摘要： Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.

公开(公告)号：US11609266B2

公开(公告)日：2023-03-21

申请号：US17531638

申请日：2021-11-19

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Thomas Jones

IPC分类号： G01R31/28 ,  G01R1/04

摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US20230129112A1

公开(公告)日：2023-04-27

申请号：US17841471

申请日：2022-06-15

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Tom Jones

IPC分类号： G01R31/28 ,  G01R1/04

摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US11567119B2

公开(公告)日：2023-01-31

申请号：US17531649

申请日：2021-11-19

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Thomas Jones

IPC分类号： G01R31/28 ,  G01R1/04

摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US20220187361A1

公开(公告)日：2022-06-16

申请号：US17531649

申请日：2021-11-19

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Tom Jones

IPC分类号： G01R31/28 ,  G01R1/04

摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.