公开(公告)号：US20240183898A1

公开(公告)日：2024-06-06

申请号：US18440226

申请日：2024-02-13

Applicant: Advantest Test Solutions, Inc.

Inventor： Karthik Ranganathan ,  Aritomo Kikuchi ,  Merlin Wallner ,  Rajan Surve ,  Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Thomas Jones

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2875 ,  G01R1/0458 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2874

Abstract: An active thermal interposer (ATI) device for use in testing integrated circuit device under test (DUT) having thermal isolation structures. The ATI device includes a formation having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the formation, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the formation is disposed adjacent to an interface surface of the DUT during testing of the DUT. The ATI device includes a plurality of thermal resistance structures configured to resist thermal conductance between the plurality of heating zones.

公开(公告)号：US20240036104A1

公开(公告)日：2024-02-01

申请号：US18378589

申请日：2023-10-10

Applicant: Advantest Test Solutions, Inc.

Inventor： Gregory Cruzan ,  Karthik Ranganathan ,  Gilberto Oseguera ,  Joe Koeth ,  Paul Ferrari ,  James Hastings ,  Chee Wah Ho

IPC: G01R31/28

CPC classification number: G01R31/2877 ,  G01R31/2863

Abstract: Embodiments of the present invention provide testing systems with liquid cooled thermal arrays that can pivot freely in three dimensions allowing surfaces to be brought into even, level, and secure contact, thereby preventing air gaps between surfaces and improving thermal performance. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices. Gimbaled mounts can be disposed on a bottom surface of individual thermal interface boards (TIBs) of a test system, and/or on top of individual thermal heads of a thermal array (TA) having a common cold plate (or having multiple cold plates).

公开(公告)号：US20240003967A1

公开(公告)日：2024-01-04

申请号：US18204309

申请日：2023-05-31

Applicant: Advantest Test Solutions, Inc.

Inventor： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Thomas Jones

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2875 ,  G01R31/2867 ,  G01R31/2863 ,  G01R1/0458 ,  G01R31/2874

Abstract: A stand-alone active thermal interposer device for use in testing an unpackaged integrated circuit device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US20230393190A1

公开(公告)日：2023-12-07

申请号：US17830940

申请日：2022-06-02

Applicant: Advantest Test Solutions, Inc.

Inventor： Karthik Ranganathan ,  Gregory Cruzan ,  Gilberto Oseguera ,  Kiyokawa Toshiyuki ,  Shigihara Takayuki

IPC: G01R31/28

CPC classification number: G01R31/2887 ,  G01R31/2834

Abstract: A testing apparatus includes a tester rack with a plurality of slots where at least one slot in the tester rack is a dedicated slot operable to receive a test interface board (TIB) from a back of the tester rack, where the back of the tester rack is opposite a front of a tester rack, and where the front of the tester rack faces a handler and a front-facing elevator. The apparatus also includes a handler operable to load devices under test (DUTs) onto the TIB and a front-facing elevator move the TIB from the dedicated slot to an available slot in the tester rack, wherein the available slot includes power electronics operable to connect to the TIB to test devices under test (DUT) disposed on the TIB.

公开(公告)号：US20230314499A1

公开(公告)日：2023-10-05

申请号：US18086333

申请日：2022-12-21

Applicant: Advantest Test Solutions, Inc.

Inventor： Paul Ferrari

IPC: G01R31/28

CPC classification number: G01R31/2863 ,  G01R31/2865 ,  G01R31/2875 ,  G01R31/2879

Abstract: The presented systems and methods enable efficient and effective exchange of test support components. There are a variety of different test support components (e.g., active thermal interposer (ATI) device, exchange kit, etc.) that are configured to support various testing functions. In one embodiment, an automated test equipment (ATE) system comprises: a support component configured to enable support functions associated with testing of a device under test (DUT); a support component head configured to selectively couple with the support component; and an exchange socket configured to hold the support component for a portion of selectively coupling the support component and the support component head.

公开(公告)号：US11754620B2

公开(公告)日：2023-09-12

申请号：US17744403

申请日：2022-05-13

Applicant: Advantest Test Solutions, Inc.

Inventor： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Tom Jones

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2875 ,  G01R1/0458 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2874

Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US20230143240A1

公开(公告)日：2023-05-11

申请号：US17520202

申请日：2021-11-05

Applicant: Advantest Test Solutions, Inc.

Inventor： Gregory Cruzan ,  Karthik Ranganathan ,  Mohammad Ghazvini ,  Paul Ferrari ,  Samer Kabbani ,  Todd Berk ,  Thomas Jones

IPC: G01R31/28

CPC classification number: G01R31/2877 ,  G01R31/2879

Abstract: Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.

公开(公告)号：US20230083634A1

公开(公告)日：2023-03-16

申请号：US17877660

申请日：2022-07-29

Applicant: Advantest Test Solutions, Inc.

Inventor： KARTHIK RANGANATHAN ,  GILBERTO OSEGUERA ,  GREGORY CRUZAN ,  JOE KOETH ,  IKEDA HIROKI ,  KIYOKAWA TOSHIYUKI

IPC: G01R31/28 ,  G01R1/04

Abstract: An automated test equipment (ATE) includes a test interface board assembly. The test interface board includes a socket configured to provide electrical couplings from the test interface board to a device under test (DUT). The socket is further configured to accept an active thermal interposer (ATI) device while the DUT is disposed in the socket. The socket includes a plurality of spring-loaded roller retention devices configured to retain one or more devices in the socket. The ATE further includes a Z-axis interface plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the DUT into the socket and an ATI placement plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the ATI device into the socket.

公开(公告)号：US11587640B2

公开(公告)日：2023-02-21

申请号：US17531486

申请日：2021-11-19

Applicant: Advantest Test Solutions, Inc.

Inventor： Karthik Ranganathan ,  Gregory Cruzan ,  Samer Kabbani ,  Gilberto Oseguera ,  Ira Leventhal

IPC: G01R31/319 ,  G11C29/56 ,  G01R31/28

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

公开(公告)号：US11573262B2

公开(公告)日：2023-02-07

申请号：US17531463

申请日：2021-11-19

Applicant: Advantest Test Solutions, Inc.

Inventor： Karthik Ranganathan ,  Gregory Cruzan ,  Paul Ferrari ,  Samer Kabbani ,  Martin Fischer

IPC: G01R31/28 ,  G05B15/02

Abstract: Disposing a DUT between a cold plate and an active thermal interposer device of the thermal management head. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality zones by controlling a supply of coolant to a cold plate, and individually controlling heating of each zone of the plurality zones.