公开(公告)号：US20220276301A1

公开(公告)日：2022-09-01

申请号：US17725164

申请日：2022-04-20

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan

IPC分类号： G01R31/28 ,  G01R31/3185 ,  H01L23/473

摘要： A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system for generating signals for input to the circuits and for processing output signals from the circuits for testing the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer thermal interposer (TI) layer operable to contact a second surface of the wafer and operable to selectively heat areas of the wafer, and a cold plate disposed under the wafer TI layer and operable to cool the wafer. The system further includes a thermal controller for selectively heating and maintaining temperatures of the areas of the wafer by controlling cooling of the cold plate and by controlling selective heating of the wafer TI layer.

公开(公告)号：US20240183897A1

公开(公告)日：2024-06-06

申请号：US18440191

申请日：2024-02-13

申请人： Advantest Test Solutions, Inc.

发明人： Karthik Ranganathan ,  Aritomo Kikuchi ,  Merlin Wallner ,  Rajan Surve ,  Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan

IPC分类号： G01R31/28

CPC分类号： G01R31/2875 ,  G01R31/2856 ,  G01R31/2877

摘要： A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system testing the circuits of the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer scale active thermal interposer layer operable to contact a second surface of the wafer and containing a plurality of thermal zones corresponding to a die layout of the wafer and further operable to selectively heat areas of the wafer. The thermal zones are thermally isolated using a plurality of thermal resistance structures disposed between the thermal zones.

公开(公告)号：US20230393188A1

公开(公告)日：2023-12-07

申请号：US18234635

申请日：2023-08-16

申请人： Advantest Test Solutions, Inc.

发明人： Gregory Cruzan ,  Karthik Ranganathan ,  Gilberto Oseguera ,  Joe Koeth ,  Paul Ferrari ,  James Hastings ,  Chee Wah Ho

IPC分类号： G01R31/28 ,  G01R1/04

CPC分类号： G01R31/2863 ,  G01R1/0466 ,  G01R31/2889 ,  G01R31/2877

摘要： Embodiments of the present invention provide a gimbaling socket structure that uses tension to bring a device under test (DUT) disposed in the socket into secure contact with a liquid cooled thermal array or the like to cool the DUT during testing. The gimbaling socket structure is secured to a tension spring and can move freely in 3 dimensions to bring the surfaces of the DUT and the thermal array (or components thereof, such as TEC/ATI layers) into even, level, and secure contact with each other, thereby preventing air gaps between surfaces and improving thermal performance. The even, secure contact between surfaces improves thermal cooling and reduces variation in cooling efficiency. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices.

公开(公告)号：US11835549B2

公开(公告)日：2023-12-05

申请号：US17585228

申请日：2022-01-26

申请人： Advantest Test Solutions, Inc.

发明人： Gregory Cruzan ,  Karthik Ranganathan ,  Gilberto Oseguera ,  Joe Koeth ,  Paul Ferrari ,  James Hastings ,  Chee Wah Ho

IPC分类号： G01R31/28

CPC分类号： G01R31/2877 ,  G01R31/2863

摘要： Embodiments of the present invention provide testing systems with liquid cooled thermal arrays that can pivot freely in three dimensions allowing surfaces to be brought into even, level, and secure contact, thereby preventing air gaps between surfaces and improving thermal performance. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices. Gimbaled mounts are disposed on a bottom surface of individual thermal interface boards (TIBs) of a test system, and/or on top of individual thermal heads of a thermal array (TA) having a common cold plate (or having multiple cold plates).

公开(公告)号：US11774492B2

公开(公告)日：2023-10-03

申请号：US17841491

申请日：2022-06-15

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Gregory Cruzan ,  Karthik Ranganathan ,  Todd Berk ,  Ian Williams ,  Mohammad Ghazvini ,  Tom Jones

IPC分类号： G01R31/28 ,  G01R1/04

CPC分类号： G01R31/2875 ,  G01R1/0458 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2874

摘要： A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

公开(公告)号：US11549981B2

公开(公告)日：2023-01-10

申请号：US17479998

申请日：2021-09-20

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Kazuyuki Yamashita ,  Hiroki Ikeda ,  Ira Leventhal ,  Mohammad Ghazvini ,  Paul Ferrari ,  Karthik Ranganathan ,  Gregory Cruzan ,  Gilberto Oseguera

IPC分类号： G01R31/28

摘要： An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

公开(公告)号：US20220206061A1

公开(公告)日：2022-06-30

申请号：US17531463

申请日：2021-11-19

申请人： Advantest Test Solutions, Inc.

发明人： Karthik Ranganathan ,  Gregory Cruzan ,  Paul Ferrari ,  Samer Kabbani ,  Martin Fischer

IPC分类号： G01R31/28 ,  G05B15/02

摘要： Disposing a DUT between a cold plate and an active thermal interposer device of the thermal management head. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality zones by controlling a supply of coolant to a cold plate, and individually controlling heating of each zone of the plurality zones.

公开(公告)号：US20220155364A1

公开(公告)日：2022-05-19

申请号：US17528002

申请日：2021-11-16

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Paul Ferrari ,  Ikeda Hiroki ,  Kiyokawa Toshiyuki ,  Greg Cruzan ,  Karthik Ranganathan

IPC分类号： G01R31/28 ,  G01R31/3185 ,  H01L23/473

摘要： A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system for generating signals for input to the circuits and for processing output signals from the circuits for testing the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer thermal interposer (TI) layer operable to contact a second surface of the wafer and operable to selectively heat areas of the wafer, and a cold plate disposed under the wafer TI layer and operable to cool the wafer. The system further includes a thermal controller for selectively heating and maintaining temperatures of the areas of the wafer by controlling cooling of the cold plate and by controlling selective heating of the wafer TI layer.

公开(公告)号：US11940487B2

公开(公告)日：2024-03-26

申请号：US18094899

申请日：2023-01-09

申请人： Advantest Test Solutions, Inc.

发明人： Samer Kabbani ,  Kazuyuki Yamashita ,  Ikeda Hiroki ,  Ira Leventhal ,  Mohammad Ghazvini ,  Paul Ferrari ,  Karthik Ranganathan ,  Gregory Cruzan ,  Gilberto Oseguera

IPC分类号： G01R31/28

CPC分类号： G01R31/2891 ,  G01R31/2875 ,  G01R31/2877 ,  G01R31/2889

摘要： An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

公开(公告)号：US11852678B2

公开(公告)日：2023-12-26

申请号：US18076253

申请日：2022-12-06

申请人： Advantest Test Solutions, Inc.

发明人： Karthik Ranganathan ,  Gregory Cruzan ,  Paul Ferrari ,  Samer Kabbani ,  Martin Fischer

IPC分类号： G01R31/28 ,  G05B15/02

CPC分类号： G01R31/2877 ,  G05B15/02

摘要： Placing a first side of an active thermal interposer device of a thermal management head against a device under test (DUT). Disposing a cold plate against a second side of the active thermal interposer. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to the cold plate, and individually controlling heating of each zone of the plurality of zones.