公开(公告)号：US20150343390A1

公开(公告)日：2015-12-03

申请号：US14654768

申请日：2013-12-23

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Kambiz Ansari ,  Shilin Chen ,  Christina Yuan Ling Tan ,  Isabel Rodriguez

IPC: B01D71/02 ,  B01D53/22 ,  B01D61/14 ,  B01D67/00 ,  B01D61/02

CPC classification number: B01D71/022 ,  B01D53/228 ,  B01D61/025 ,  B01D61/145 ,  B01D67/0053 ,  B01D67/0062 ,  B01D67/0069 ,  B01D69/02 ,  B01D69/06 ,  B01D69/10 ,  B01D69/105 ,  B01D2325/021 ,  C25D1/08 ,  C25D3/12 ,  C25D5/003 ,  C25D5/022 ,  C25D7/123

Abstract: The present disclosure relates to a method of forming a metallic layer having pores extending therethrough, the method comprising the steps of: (a) contacting a cathode substrate with an electrolyte solution comprising at least one cation; reducing the cation to deposit the metallic layer on a surface of the cathode substrate; and (c) generating a plurality of non-conductive regions on the cathode substrate surface during reducing step (b); wherein the deposition of the metallic layer is substantially prevented on the non-conductive regions on the cathode substrate surface to thereby form pores extending through the deposited metallic layer. The present disclosure further provides a metallic porous membrane fabricated by the disclosed process.

Abstract translation: 本发明涉及一种形成具有延伸穿过其中的孔的金属层的方法，所述方法包括以下步骤：（a）使阴极基底与包含至少一种阳离子的电解质溶液接触; 减少阳极以将金属层沉积在阴极衬底的表面上; 和（c）在还原步骤（b）期间在阴极衬底表面上产生多个非导电区域; 其中基本上防止在阴极衬底表面上的非导电区域上金属层的沉积，从而形成延伸穿过沉积的金属层的孔。 本公开还提供了通过所公开的方法制造的金属多孔膜。

公开(公告)号：US09636639B2

公开(公告)日：2017-05-02

申请号：US14654768

申请日：2013-12-23

Applicant: Agency for Science, Technology and Research

Inventor： Kambiz Ansari ,  Shilin Chen ,  Christina Yuan Ling Tan ,  Isabel Rodriguez

IPC: B01D39/00 ,  B01D39/14 ,  B01D67/00 ,  B01D71/02 ,  B01D69/06 ,  B01D53/22 ,  B01D61/02 ,  B01D61/14 ,  B01D69/02 ,  B01D69/10 ,  C25D1/08 ,  C25D3/12 ,  C25D5/00 ,  C25D5/02 ,  C25D7/12

CPC classification number: B01D71/022 ,  B01D53/228 ,  B01D61/025 ,  B01D61/145 ,  B01D67/0053 ,  B01D67/0062 ,  B01D67/0069 ,  B01D69/02 ,  B01D69/06 ,  B01D69/10 ,  B01D69/105 ,  B01D2325/021 ,  C25D1/08 ,  C25D3/12 ,  C25D5/003 ,  C25D5/022 ,  C25D7/123

Abstract: The present disclosure relates to a method of forming a metallic layer having pores extending therethrough, the method comprising the steps of: (a) contacting a cathode substrate with an electrolyte solution comprising at least one cation; reducing the cation to deposit the metallic layer on a surface of the cathode substrate; and (c) generating a plurality of non-conductive regions on the cathode substrate surface during reducing step (b); wherein the deposition of the metallic layer is substantially prevented on the non-conductive regions on the cathode substrate surface to thereby form pores extending through the deposited metallic layer. The present disclosure further provides a metallic porous membrane fabricated by the disclosed process.