Electronic identification device
    1.
    发明授权
    Electronic identification device 失效
    电子识别装置

    公开(公告)号:US5605067A

    公开(公告)日:1997-02-25

    申请号:US530634

    申请日:1995-09-20

    Applicant: Alain Juan

    Inventor: Alain Juan

    CPC classification number: G07C9/00944 Y10T70/7073 Y10T70/7802 Y10T70/7904

    Abstract: Electronic identification device, notably a key, intended to be used with an electronic lock and comprising in a conducting body (16) two recesses (8,10) arranged facing each other and separated by an intermediate wall (14), an opening (12) being provided in the intermediate wall between the two recesses. Two conducting elements (22,28) are arranged in the two recesses and in the opening, these two elements being electrically and mechanically connected to each other with the aid of a stud (26) driven into a blind hole (34) respectively associated with the two conducting elements (22,28). The electronic unit (2) is electrically connected to the body (16) and to the two conducting elements (22,28) with the aid of conducting pads (48,50) arranged on a sheet (38) placed in one of the two recesses (8) between one plate (24) and the intermediate wall (14). The conducting elements (22,28) are electrically insulated from the conducting body (16).

    Abstract translation: 电子识别装置,特别是键,旨在与电子锁一起使用并且包括在导电体(16)中,两个彼此面对地布置并由中间壁(14)隔开的凹部(8,10),开口(12) )设置在两个凹部之间的中间壁中。 两个导电元件(22,28)布置在两个凹部中并且在开口中,这两个元件借助于被驱动到分别与...相关联的盲孔(34)的螺柱(26)电连接和机械地彼此连接 两个导电元件(22,28)。 电子单元(2)借助于布置在放置在两个之一中的片材(38)上的导电垫(48,50),电连接到主体(16)和两个导电元件(22,28) 一个板(24)和中间壁(14)之间的凹部(8)。 导电元件(22,28)与导电体(16)电绝缘。

    Method of manufacture of electronic modules for cards with microcircuits
    2.
    发明授权
    Method of manufacture of electronic modules for cards with microcircuits 失效
    具有微电路卡的电子模块的制造方法

    公开(公告)号:US4835846A

    公开(公告)日:1989-06-06

    申请号:US243857

    申请日:1988-09-13

    Abstract: The card with microcircuits of this invention includes an electronic module having standardized electrodes. To make up this module a first unit is fabricated including a first insulating substrate covered by the electrodes. Under each electrode is located a first hole. Next there is fabricated a second unit which includes an integrated circuit chip the connection terminals of which are coupled to conductors printed onto a second insulating substrate. One of the free ends of each conductor falls directly over a second hole provided in the second insulating substrate. The arrangement is such that the first hole is coaxial with the second hole corresponding thereto when the units are superposed. The two units are then assembled by superposing them and soldering the free ends of the conductors of the second unit to the electrodes of the first unit by introducing a soldering tool into the second hole. The module is employed in particular in a microcircuit card of standardized dimensions.

    Abstract translation: 具有本发明微电路的卡包括具有标准电极的电子模块。 为了组成该模块,制造包括被电极覆盖的第一绝缘基板的第一单元。 在每个电极下方设有第一个孔。 接下来,制造第二单元,其包括集成电路芯片,其连接端子被耦合到印刷到第二绝缘基板上的导体。 每个导体的一个自由端直接落在设置在第二绝缘基板中的第二孔上。 当这些单元重叠时,该布置使得第一孔与对应于其的第二孔同轴。 然后通过将两个单元叠加并通过将焊接工具引入第二孔而将第二单元的导体的自由端焊接到第一单元的电极来组装。 该模块特别用于标准尺寸的微电路卡。

    Process for assembling and connecting integrated circuits to circuit
units and apparatus for carrying out the process
    4.
    发明授权
    Process for assembling and connecting integrated circuits to circuit units and apparatus for carrying out the process 失效
    将集成电路组装和连接到电路单元的过程和用于执行该过程的装置

    公开(公告)号:US4672742A

    公开(公告)日:1987-06-16

    申请号:US787895

    申请日:1985-10-16

    Applicant: Alain Juan

    Inventor: Alain Juan

    CPC classification number: H01L21/67144 Y10T29/49144 Y10T29/53178

    Abstract: The assembling of integrated circuits takes place in a welding post in which a film bearing circuit units advances step by step. Each integrated circuit is brought into the welding post by a rotating platform driven step by step in synchronism with the film. The integrated circuits are loaded in a loading post angularly separated from the welding post and very slightly separated from the exact position they should occupy following their transfer to the welding post. The position error is corrected in an alignment post by simply sliding the integrated ciruit over the platform surface. Thus three operations may be simultaneously performed (loading, alignment and welding) on three individual integrated circuits.

    Abstract translation: 集成电路的组装发生在其中胶片轴承电路单元逐步前进的焊接柱中。 每个集成电路通过与膜同步地逐步驱动的旋转平台被带入焊接柱。 集成电路装载在与焊接柱成角度地分离的加载柱中,并且在与焊接柱传递之后应该占据的精确位置非常轻微地分离。 通过简单地将集成电路滑过平台表面,在对准柱中校正位置误差。 因此,可以在三个单独的集成电路上同时执行三个操作(加载,对准和焊接)。

    HANDPIECE FOR DENTAL OR SURGICAL USE
    5.
    发明申请
    HANDPIECE FOR DENTAL OR SURGICAL USE 审中-公开
    用于牙科或外科手术的手术

    公开(公告)号:US20080014551A1

    公开(公告)日:2008-01-17

    申请号:US11777379

    申请日:2007-07-13

    Applicant: Alain Juan

    Inventor: Alain Juan

    CPC classification number: A61B17/88 A61C1/08 A61C2201/00

    Abstract: The present invention concerns a handpiece for dental or surgical use including a body via which the practitioner holds the instrument, characterized in that the body is made of a titanium-molybdenum alloy.

    Abstract translation: 本发明涉及一种用于牙科或外科用途的手持件,其包括从业者通过该主体固定器械的主体,其特征在于,所述主体由钛 - 钼合金制成。

    Electronic assembly including an electronic unit connected to a coil
    6.
    发明授权
    Electronic assembly including an electronic unit connected to a coil 有权
    电子组件,包括连接到线圈的电子单元

    公开(公告)号:US06239967B1

    公开(公告)日:2001-05-29

    申请号:US09155894

    申请日:1998-10-08

    Applicant: Alain Juan

    Inventor: Alain Juan

    CPC classification number: G06K19/0775 G06K19/07749 G06K19/07779

    Abstract: The electronic assembly (20) includes an electronic unit (24), formed of an electronic module (26) and two conductive tongues (28, 30) defining two electric contact pads of said electronic unit, and a coil (22). The body (40) of the coil (22) is partially superposed onto the two tongues and fixed to the latter in a durable manner by means of a solidified binder material. The two ends of the coil are bonded respectively onto the two tongues (28, 30).

    Abstract translation: 电子组件(20)包括由电子模块(26)形成的电子单元(24)和限定所述电子单元的两个电接触垫的两个导电舌片(28,30)和线圈(22)。 线圈(22)的主体(40)部分地重叠在两个舌部上,并且通过固化的粘合剂材料以耐用的方式固定在其上。 线圈的两端分别接合在两个舌片(28,30)上。

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