公开(公告)号：US20190081706A1

公开(公告)日：2019-03-14

申请号：US15873151

申请日：2018-01-17

Applicant: Alcatel-Lucent USA Inc.

Inventor： David Neilson ,  Michael Zierdt ,  Yee Leng Low ,  Nagesh Basavanhally

IPC: H04B10/29 ,  H04B10/114 ,  H04B10/40 ,  H04B10/80

Abstract: The present disclosure is directed to an apparatus comprising two components mounted on opposite sides of a window but proximate to each other where the two components are communicatively coupled through an optical link and where each component can be communicatively coupled with a wireless data source. In another embodiment, the components can include one or more of light indicators, audio indicators, and magnetic assistance to guide an optical alignment between the two components. In another embodiment, the components can include one or more of an array of lasers, larger photo diodes, adjustable lenses, and can utilize gain parameters to increase the tolerance level for a misaligned optical link. In another embodiment, methods are disclosed to perform communication coupling via an optical transmission link. In another embodiment, methods are disclosed to assist a user in optically aligning the two components.

公开(公告)号：US09308596B2

公开(公告)日：2016-04-12

申请号：US14157887

申请日：2014-01-17

Applicant: ALCATEL-LUCENT USA INC.

Inventor： Nagesh Basavanhally

IPC: G02B6/12 ,  B23K1/20 ,  B32B3/26 ,  B23K1/00 ,  B23K3/06 ,  G02B6/42

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/42 ,  B32B3/266 ,  G02B6/4214 ,  G02B6/4238 ,  Y10T428/24331

Abstract: An illustrative assembly includes a first component having a hole between two first component surfaces. The hole includes a first metal layer on the first component inside the hole. A second component includes a second component surfaced adjacent one of the first component surfaces. The second component includes a second metal layer on the second component. A fusible material is at least partially in the hole and at least partially in the recess. The metal alloy establishes a connection between the first and second metal layers.

Abstract translation: 示例性组件包括在两个第一部件表面之间具有孔的第一部件。 该孔包括孔内的第一部件上的第一金属层。 第二部件包括邻近第一部件表面之一表面的第二部件。 第二部件包括第二部件上的第二金属层。 可熔材料至少部分地在孔中并且至少部分地在凹部中。 金属合金在第一和第二金属层之间建立连接。

公开(公告)号：US10359565B2

公开(公告)日：2019-07-23

申请号：US15426729

申请日：2017-02-07

Applicant: Alcatel-Lucent USA Inc.

Inventor： Yee L. Low ,  Nagesh Basavanhally

IPC: G02B6/12 ,  G02B6/42 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  G02B6/43

Abstract: An optoelectronic circuit having a substantially planar double-sided substrate, each side of which has a respective plurality of electrically conducting tracks and a respective plurality of planar optical waveguides. The substrate also has at least one via crossing the substrate in a manner that can be used to establish an optical path across the substrate, e.g., between optical waveguides located on different sides thereof. In an example embodiment, the electrically conducting tracks and planar optical waveguides are configured to operatively connect various optoelectronic devices and auxiliary electrical circuits attached to the two sides of the substrate using hybrid-integration technologies. In some embodiments, two or more of such double-sided substrates can be stacked and optically and electrically interconnected to create an integrated three-dimensional assembly.

公开(公告)号：US20180224601A1

公开(公告)日：2018-08-09

申请号：US15426729

申请日：2017-02-07

Applicant: Alcatel-Lucent USA Inc.

Inventor： Yee L. Low ,  Nagesh Basavanhally

IPC: G02B6/12 ,  G02B6/42 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: G02B6/12002 ,  G02B6/12004 ,  G02B6/4232 ,  G02B6/43 ,  G02B2006/12104 ,  H05K1/0274 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10734

Abstract: An optoelectronic circuit having a substantially planar double-sided substrate, each side of which has a respective plurality of electrically conducting tracks and a respective plurality of planar optical waveguides. The substrate also has at least one via crossing the substrate in a manner that can be used to establish an optical path across the substrate, e.g., between optical waveguides located on different sides thereof. In an example embodiment, the electrically conducting tracks and planar optical waveguides are configured to operatively connect various optoelectronic devices and auxiliary electrical circuits attached to the two sides of the substrate using hybrid-integration technologies. In some embodiments, two or more of such double-sided substrates can be stacked and optically and electrically interconnected to create an integrated three-dimensional assembly.