公开(公告)号：US08391009B2

公开(公告)日：2013-03-05

申请号：US12895952

申请日：2010-10-01

申请人： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung

发明人： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung

IPC分类号： H05K7/20

CPC分类号： F21V29/67 ,  F21V29/74 ,  F21Y2115/10 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/4069 ,  H05K2201/10106 ,  H01L2924/00

摘要： A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A heat conducting adhesive is filled in the through-hole. The heat conducting adhesive is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the heat conducting adhesive to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs.

摘要翻译： 散热组件包括具有相对的第一和第二面的电路板。 电路板还包括从第一面延伸穿过第二面的通孔。 发电元件安装在电路板的第一面上并电耦合到电路板。 发热元件包括与通孔对准的导热部分。 散热单元包括具有与电路板的第二面接触的接合面的基座。 导热粘合剂填充在通孔中。 导热粘合剂与基座的接合面和发热元件的导热部分接合。 发热元件通过导热粘合剂直接与散热单元接合，从而有效地提高总的散热效率，同时减少构件的数量以降低制造成本。

公开(公告)号：US08279607B2

公开(公告)日：2012-10-02

申请号：US12826779

申请日：2010-06-30

申请人： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung ,  Chung-Ken Cheng ,  Jui-Feng Wang

发明人： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung ,  Chung-Ken Cheng ,  Jui-Feng Wang

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/09563 ,  H05K2201/10409 ,  H01L2924/00

摘要： A cooling module assembly method includes forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, with the at least one heat-generating element aligned with and covering the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole.

摘要翻译： 冷却模块组装方法包括在电路板上形成至少一个通孔; 将电路板耦合到散热单元，使得电路板的表面耦合到散热单元的耦合面; 用金属焊料填充至少一个通孔; 将至少一个发热元件固定到所述电路板的另一个表面，所述至少一个发热元件与所述至少一个通孔对齐并覆盖所述至少一个通孔; 以及通过熔化所述至少一个通孔中的所述金属焊料将所述至少一个发热元件和所述散热单元焊接在一起。

公开(公告)号：US20120049698A1

公开(公告)日：2012-03-01

申请号：US12939237

申请日：2010-11-04

申请人： Alex Horng ,  Kuan-Yin Hou ,  Chung-Ken Cheng ,  Chi-Hung Kuo ,  Chih-Hao Chung

发明人： Alex Horng ,  Kuan-Yin Hou ,  Chung-Ken Cheng ,  Chi-Hung Kuo ,  Chih-Hao Chung

IPC分类号： H02K11/00

CPC分类号： H02K29/08 ,  H02P6/16 ,  H02P6/26

摘要： A BLDC motor with dual rotation directions includes a rotor and a stator. The rotor has a rotating portion and a magnet portion, wherein the magnet portion has a plurality of magnetic poles each having a magnetic pole face. The stator has an excitation assembly and a control assembly. The rotating portion of the rotor is rotatably coupled with the stator. The excitation assembly has at least one excitation face and at least one coil. The control assembly is coupled to the at least one coil and has two sensors adjacent to the magnet portion. A distance exists between the two sensors on a rotational path of the magnet portion.

摘要翻译： 具有双旋转方向的BLDC电动机包括转子和定子。 转子具有旋转部分和磁体部分，其中磁体部分具有各自具有磁极面的多个磁极。 定子具有激励组件和控制组件。 转子的旋转部分与定子可旋转地连接。 激励组件具有至少一个激励面和至少一个线圈。 控制组件联接到至少一个线圈并且具有与磁体部分相邻的两个传感器。 在磁体部分的旋转路径上的两个传感器之间存在距离。

公开(公告)号：US20110292614A1

公开(公告)日：2011-12-01

申请号：US12826779

申请日：2010-06-30

申请人： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung ,  Chung-Ken Cheng ,  Jui-Feng Wang

发明人： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung ,  Chung-Ken Cheng ,  Jui-Feng Wang

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/09563 ,  H05K2201/10409 ,  H01L2924/00

摘要： A cooling module assembly method comprises forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, wherein the at least one heat-generating element aligns with and covers the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole.

摘要翻译： 冷却模块组装方法包括在电路板上形成至少一个通孔; 将电路板耦合到散热单元，使得电路板的表面耦合到散热单元的耦合面; 用金属焊料填充至少一个通孔; 将至少一个发热元件固定到所述电路板的另一个表面，其中所述至少一个发热元件与所述至少一个通孔对准并覆盖所述至少一个通孔; 以及通过熔化所述至少一个通孔中的所述金属焊料将所述至少一个发热元件和所述散热单元焊接在一起。

公开(公告)号：US20110279981A1

公开(公告)日：2011-11-17

申请号：US12818211

申请日：2010-06-18

申请人： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung

发明人： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  F21V29/673 ,  F21V29/677 ,  F21V29/773 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/0061 ,  H05K2201/09027 ,  H05K2201/09572 ,  H05K2201/10106 ,  H01L2924/00

摘要： A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A metal solder is filled in the through-hole. The metal solder is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the metal solder to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs.

摘要翻译： 散热组件包括具有相对的第一和第二面的电路板。 电路板还包括从第一面延伸穿过第二面的通孔。 发电元件安装在电路板的第一面上并电耦合到电路板。 发热元件包括与通孔对准的导热部分。 散热单元包括具有与电路板的第二面接触的接合面的基座。 金属焊料填充在通孔中。 金属焊料与基座的接合面和发热元件的导热部分接合。 发热元件通过金属焊料直接与散热单元接合，从而有效地提高总的散热效率，同时减少构件的数量以降低制造成本。

公开(公告)号：US20100295436A1

公开(公告)日：2010-11-25

申请号：US12468405

申请日：2009-05-19

申请人： Alex Horng ,  Chih-Hao Chung ,  Heng-Yu Hu ,  Ming-Tsung Li

发明人： Alex Horng ,  Chih-Hao Chung ,  Heng-Yu Hu ,  Ming-Tsung Li

IPC分类号： H01J61/52

CPC分类号： H01J61/52 ,  F21K9/232 ,  F21V3/00 ,  F21V29/673 ,  F21V29/677 ,  F21V29/74 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10

摘要： A lamp includes a housing, a heat sink, a light emitter, a fan and a blocking ring. The housing has an air inlet portion and an air outlet portion formed in a wall of the housing. The heat sink includes a base plate and a plurality of fins surrounding the base plate to define a compartment. Each of the fins have a first end facing the air inlet portion of the housing and a second end connecting with the base plate. The light emitter is fixed to the base plate of the heat sink. The fan is fixed inside the compartment of the heat sink. The blocking ring is mounted between the air inlet portion and the heat sink. Accordingly, the blocking ring blocks part of the heated airflow from flowing back to the air inlet portion and turbulence is avoided effectively. Therefore, the airflow inside the housing can flow smoothly through the air outlet to transfer heat to the environment and heat dissipating efficiency is enhanced.

摘要翻译： 灯包括外壳，散热器，发光器，风扇和阻挡环。 壳体具有形成在壳体的壁中的空气入口部分和空气出口部分。 散热器包括基板和围绕基板的多个翅片以限定隔间。 每个翅片具有面向壳体的空气入口部分的第一端和与基板连接的第二端。 光发射器固定在散热片的底板上。 风扇固定在散热器的隔室内。 阻挡环安装在空气入口部分和散热器之间。 因此，阻挡环阻止部分加热气流回流到空气入口部分，并且有效地避免了湍流。 因此，壳体内部的气流可以平稳地流过空气出口，以将热量传递到环境中，并且散热效率得到提高。

公开(公告)号：US08292465B2

公开(公告)日：2012-10-23

申请号：US13316237

申请日：2011-12-09

申请人： Alex Horng ,  Chih-Hao Chung ,  Heng-Yu Hu ,  Ming-Tsung Li

发明人： Alex Horng ,  Chih-Hao Chung ,  Heng-Yu Hu ,  Ming-Tsung Li

IPC分类号： F21V29/00

CPC分类号： H01J61/52 ,  F21K9/232 ,  F21V3/00 ,  F21V29/673 ,  F21V29/677 ,  F21V29/74 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10

摘要： A lamp includes a housing, a heat sink, a light emitter, a fan and a blocking ring. The housing includes first and second shells, with the first shell forming a light-transparent portion and a first engaging portion. An air outlet portion is formed in a wall of the first shell, with the second shell forming a second engaging portion and a base. An air inlet portion is formed in a wall of the second shell. The heat sink includes a base plate and a plurality of fins defining a compartment. Each of the fins has first and second ends. The light emitter is electrically connected to the base. The blocking ring is mounted inside the housing. The blocking ring has two sides forming first and second flanges. The blocking ring further includes a side forming a protrusion ring and partially covering an outer periphery of the heat sink.

摘要翻译： 灯包括外壳，散热器，发光器，风扇和阻挡环。 壳体包括第一和第二壳体，第一壳体形成透光部分和第一接合部分。 空气出口部分形成在第一壳体的壁中，第二壳体形成第二接合部分和基部。 空气入口部分形成在第二壳体的壁中。 散热器包括基板和限定隔室的多个翅片。 每个翅片具有第一和第二端。 光发射器电连接到基座。 挡圈安装在外壳内。 阻挡环具有形成第一和第二凸缘的两个侧面。 阻挡环还包括形成突出环并部分地覆盖散热器的外周的一侧。

公开(公告)号：US07905633B2

公开(公告)日：2011-03-15

申请号：US12422010

申请日：2009-04-10

申请人： Alex Horng ,  Masaharu Miyahara ,  Chih-Hao Chung

发明人： Alex Horng ,  Masaharu Miyahara ,  Chih-Hao Chung

IPC分类号： F21V29/00

CPC分类号： F21V29/004 ,  F21K9/00 ,  F21V29/713 ,  F21V29/745 ,  F21V29/75 ,  F21Y2115/10

摘要： A light emitter with heat-dissipating module includes a light unit, a first heat-dissipating member, a second heat-dissipating member and a fastening member. The light unit includes a light-emitting element and a supporting plate having a pair of opposite surfaces. The first heat-dissipating member includes a first combining surface and a heat-dissipating portion. The first combining surface contacts with one of said two opposite surfaces of the supporting plate. The second heat-dissipating member includes a second combining surface and a heat-dissipating portion. The second combining surface contacts with the other of said two opposite surfaces of the supporting plate. The fastening member couples to the supporting plate, the first heat-dissipating member and the second heat-dissipating member to fix the combination of the supporting plate and the first and second heat-dissipating members.

摘要翻译： 具有散热模块的光发射器包括光单元，第一散热构件，第二散热构件和紧固构件。 光单元包括发光元件和具有一对相对表面的支撑板。 第一散热构件包括第一组合表面和散热部分。 第一组合表面与支撑板的所述两个相对表面之一接触。 第二散热构件包括第二组合表面和散热部分。 第二组合表面与支撑板的所述两个相对表面中的另一个接触。 紧固构件联接到支撑板，第一散热构件和第二散热构件，以固定支撑板和第一和第二散热构件的组合。

公开(公告)号：US20100259932A1

公开(公告)日：2010-10-14

申请号：US12422010

申请日：2009-04-10

申请人： Alex HORNG ,  Masaharu Miyahara ,  Chih-Hao Chung

发明人： Alex HORNG ,  Masaharu Miyahara ,  Chih-Hao Chung

IPC分类号： F21V21/00

CPC分类号： F21V29/004 ,  F21K9/00 ,  F21V29/713 ,  F21V29/745 ,  F21V29/75 ,  F21Y2115/10

摘要： A light emitter with heat-dissipating module includes a light unit, a first heat-dissipating member, a second heat-dissipating member and a fastening member. The light unit includes a light-emitting element and a supporting plate having a pair of opposite surfaces. The first heat-dissipating member includes a first combining surface and a heat-dissipating portion. The first combining surface contacts with one of said two opposite surfaces of the supporting plate. The second heat-dissipating member includes a second combining surface and a heat-dissipating portion. The second combining surface contacts with the other of said two opposite surfaces of the supporting plate. The fastening member couples to the supporting plate, the first heat-dissipating member and the second heat-dissipating member to fix the combination of the supporting plate and the first and second heat-dissipating members.

摘要翻译： 具有散热模块的光发射器包括光单元，第一散热构件，第二散热构件和紧固构件。 光单元包括发光元件和具有一对相对表面的支撑板。 第一散热构件包括第一组合表面和散热部分。 第一组合表面与支撑板的所述两个相对表面之一接触。 第二散热构件包括第二组合表面和散热部分。 第二组合表面与支撑板的所述两个相对表面中的另一个接触。 紧固构件联接到支撑板，第一散热构件和第二散热构件，以固定支撑板和第一和第二散热构件的组合。

公开(公告)号：US20110284199A1

公开(公告)日：2011-11-24

申请号：US12781920

申请日：2010-05-18

申请人： Alex Horng ,  Chih-Hao Chung ,  Yu-Yuan Lu

发明人： Alex Horng ,  Chih-Hao Chung ,  Yu-Yuan Lu

IPC分类号： G05D23/19

CPC分类号： G05D23/19

摘要： A cooling module comprises a heat sink, a cooling fan, a control assembly, a temperature sensor and a resilient heat conductor. The cooling fan facilitates cooling efficiency of the heat sink. The control assembly has a circuit board controlling rotation of the cooling fan. The temperature sensor is coupled to the circuit board of the control assembly and has a sensing face. The resilient heat conductor is disposed between the heat sink and the temperature sensor and has a first contact face and a second contact face, wherein the first contact face contacts the sensing face of the temperature sensor and the second contact face contacts a face of the heat sink.

摘要翻译： 冷却模块包括散热器，冷却风扇，控制组件，温度传感器和弹性热导体。 冷却风扇有助于散热器的冷却效率。 控制组件具有控制冷却风扇旋转的电路板。 温度传感器耦合到控制组件的电路板，并具有感测面。 弹性导热体设置在散热器和温度传感器之间并且具有第一接触面和第二接触面，其中第一接触面接触温度传感器的感测面，第二接触面接触热面 水槽。