公开(公告)号：US20040170795A1

公开(公告)日：2004-09-02

申请号：US10715718

申请日：2003-11-17

Applicant: AlliedSignal Inc.

Inventor： David R. Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard J. Pommer

IPC: B32B027/02 ,  B32B017/02 ,  B32B009/00 ,  B32B033/00

CPC classification number: B32B15/08 ,  B32B7/06 ,  B32B17/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2457/08 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10T428/1476 ,  Y10T442/2861 ,  Y10T442/2992 ,  Y10T442/697

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.