公开(公告)号：US20170200527A1

公开(公告)日：2017-07-13

申请号：US15326224

申请日：2015-07-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K3/12 ,  B23K35/02 ,  B22F1/02 ,  B23K35/36 ,  B23K35/362 ,  B22F1/00 ,  H05K1/09 ,  B23K35/30

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20200294686A1

公开(公告)日：2020-09-17

申请号：US16887455

申请日：2020-05-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20240029916A1

公开(公告)日：2024-01-25

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

CPC classification number: H01B1/22 ,  H05K1/095 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/1216 ,  H05K3/1241 ,  H05K2201/0245 ,  H05K2201/0133 ,  H05K1/189

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20210350949A1

公开(公告)日：2021-11-11

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.