BUILDING LEVEL DEHUMIDIFICATION AND COOLING
    2.
    发明申请
    BUILDING LEVEL DEHUMIDIFICATION AND COOLING 审中-公开
    建筑水平除湿和冷却

    公开(公告)号:US20160302328A1

    公开(公告)日:2016-10-13

    申请号:US15186916

    申请日:2016-06-20

    Abstract: A system for cooling heat producing components in a building includes a duct coupled to a room of the building and one or more air moving devices. The duct includes a constricted section. The air moving devices move air through the constricted section of the duct such that water in the air is converted from water vapor to water droplets. The water droplets are carried downstream from the constricted section in a two-phase mixture comprising air and water.

    Abstract translation: 用于冷却建筑物中的发热部件的系统包括连接到建筑物的房间的管道和一个或多个空气移动装置。 管道包括收缩部分。 空气移动装置使空气通过管道的收缩部分,使得空气中的水从水蒸气转变成水滴。 水滴在收缩部分的下游以包含空气和水的两相混合物携带。

    Cooling system for data center
    3.
    发明授权

    公开(公告)号:US10070561B1

    公开(公告)日:2018-09-04

    申请号:US15496699

    申请日:2017-04-25

    Abstract: A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and a plurality of computing devices mounted to the rack housing. The data center can further include a cooling system that includes at least one surface that is wetted with a liquid, and delivers source air across the at least one surface such that heat is transferred from the source air to the liquid so as to produce cold air. The cold air then flows into a cold air aisle and is received in the computing devices so as to cool the computing devices.

    Modular data center row infrastructure
    4.
    发明授权
    Modular data center row infrastructure 有权
    模块化数据中心行基础设施

    公开(公告)号:US09357681B2

    公开(公告)日:2016-05-31

    申请号:US14285498

    申请日:2014-05-22

    CPC classification number: H05K7/20736 H05K7/20145 H05K7/20745

    Abstract: A data center row infrastructure module enables rapid deployment of a computing room enclosure for computer systems that provides intake air circulation to, and exhaust air removal from, the computer systems in the enclosure. The data center row infrastructure module includes free-standing exhaust plenum structures encompassing opposite sides of the enclosure and a plenum module spanning a top end of the enclosure between the free-standing exhaust plenum structures. Each free-standing exhaust plenum structure includes an internal exhaust air plenum that directs exhaust air received from the enclosure through an exhaust air outlet on a top end of the free-standing exhaust plenum structure. The plenum module establishes a bottom end of a cooling air plenum above and separate from the enclosure and between the free-standing exhaust plenum structures. Some plenum modules can direct cooling air directly to the enclosure as intake air. Some plenum modules can mix cooling air with recirculated exhaust to provide the intake air.

    Abstract translation: 数据中心行基础架构模块能够为计算机系统快速部署计算机外壳,该系统为外壳中的计算机系统提供进气流量和排出空气。 数据中心行基础设施模块包括围绕外壳的相对侧的独立排气增压室结构,以及跨越独立排气室结构之间的外壳顶端的增压室模块。 每个独立的排气增压室结构包括内部排气室,其引导从外壳接收的废气通过独立排气增压室结构的顶端上的排气出口。 增压模块建立了冷却空气室的底端,在冷却空气室的上方并与壳体分开并且在独立的排气室结构之间。 一些增压模块可以将冷却空气直接作为进气进入外壳。 一些增压模块可以将冷却空气与再循环排气混合以提供进气。

    Cooling system for data center rack

    公开(公告)号:US10201116B1

    公开(公告)日:2019-02-05

    申请号:US14093997

    申请日:2013-12-02

    Abstract: A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing that at least substantially encapsulates an interior space, and a plurality of computing devices mounted to the rack in the interior space. The data center can further include a cooling system. The cooling system includes a conduit that is disposed in the interior space of the rack housing and a fluid that flows through the conduit, wherein heat is transferred from air in the interior space to the fluid to produce cooled air in the rack housing.

    Cooling system for data center
    6.
    发明授权

    公开(公告)号:US09690337B1

    公开(公告)日:2017-06-27

    申请号:US14100371

    申请日:2013-12-09

    CPC classification number: G06F1/20 H05K7/20709 H05K7/20745

    Abstract: A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and a plurality of computing devices mounted to the rack housing. The data center can further include a cooling system that includes at least one surface that is wetted with a liquid, and delivers source air across the at least one surface such that heat is transferred from the source air to the liquid so as to produce cold air. The cold air then flows into a cold air aisle and is received in the computing devices so as to cool the computing devices.

    Cooling system for data center
    7.
    发明授权

    公开(公告)号:US09681588B1

    公开(公告)日:2017-06-13

    申请号:US14100413

    申请日:2013-12-09

    CPC classification number: H05K7/2079 H05K7/20145 H05K7/20272 H05K7/20745

    Abstract: A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and a plurality of computing devices mounted to the rack housing. The data center can further include a cooling system that includes at least one surface that is wetted with a liquid, and delivers source air across the at least one surface such that heat is transferred from the source air to the liquid so as to produce cold air. The cold air then flows into a cold air aisle and is received in the computing devices so as to cool the computing devices.

    Cooling system for data center
    8.
    发明授权

    公开(公告)号:US10684660B1

    公开(公告)日:2020-06-16

    申请号:US15600631

    申请日:2017-05-19

    Abstract: A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and a plurality of computing devices mounted to the rack housing. The data center can further include a cooling system that includes at least one surface that is wetted with a liquid, and delivers source air across the at least one surface such that heat is transferred from the source air to the liquid so as to produce cold air. The cold air then flows into a cold air aisle and is received in the computing devices so as to cool the computing devices.

    Trim cooling assembly for cooling electronic equipment

    公开(公告)号:US10231358B1

    公开(公告)日:2019-03-12

    申请号:US14181070

    申请日:2014-02-14

    Abstract: A trim cooling assembly provides a sensible trim cooling capability for intake air provided to a downstream computing pod that includes an air cooling system that provides cooling air to computer systems in the pod. The air cooling system can evaporatively chill received intake air to provide the cooling air. The trim cooling assembly is mounted externally to the computing pod and upstream of the air cooling system and includes one or more trim cooling units that can be individually controlled to provide adjustable sensible chilling of the intake air. The trim cooling units and an evaporative cooling unit in the air cooling system can be controlled to provide various levels of sensible and evaporative cooling to maintain conditions of air downstream of the evaporative cooling unit within certain ranges. Trim cooling units can be progressively activated and de-activated in stages to provide progressively adjusted sensible cooling.

    PASSIVE ROOF EXHAUSTING SYSTEM
    10.
    发明申请

    公开(公告)号:US20190032938A1

    公开(公告)日:2019-01-31

    申请号:US16147368

    申请日:2018-09-28

    Abstract: A system for passively exhausting air from a structure includes at least one pair of modules arranged on a roof of the structure. Each module has an exhaust face on one side and a sloped surface on the opposite side, and can receive exhaust air that flows upward from inside the structure. The modules can be arranged in pairs facing one another, with one of the sloped surfaces facing a direction of an environmental flow of air, so that the environmental air can flow up the sloped surface of one module and down the sloped surface of the other module without impinging on the exhaust faces of either module. The pairs can also be arranged side-by-side in an array, which can be expanded with additional pairs of modules to exhaust from the structure at a greater rate.

Patent Agency Ranking