公开(公告)号：US11768990B1

公开(公告)日：2023-09-26

申请号：US17305043

申请日：2021-06-29

Applicant: Amazon Technologies, Inc.

Inventor： Uri Leder ,  Ori Ariel ,  Max Chvalevsky ,  Benzi Denkberg ,  Guy Nakibly

IPC: G06F30/398 ,  G06F30/394 ,  G06F30/331 ,  G06F30/392

CPC classification number: G06F30/394 ,  G06F30/331 ,  G06F30/392 ,  G06F30/398

Abstract: An integrated circuit design technique utilizes a data structure describing the connections, interconnect routing information of the connections, and bandwidth requirements of the connections in an integrated circuit device to generate an interconnect flow graph having nodes, and edges connecting the nodes. The edges connecting the nodes can reflect the bandwidth requirements of the connections. The interconnect flow graph can be used to optimize and verify the integrated circuit design.