公开(公告)号：US07928562B2

公开(公告)日：2011-04-19

申请号：US12177194

申请日：2008-07-22

申请人： Amilcar R. Arvelo ,  Evan G. Colgan ,  John H. Magerlein ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Jamil A. Wakil ,  Xiaojin Wei ,  Jeffrey A. Zitz

发明人： Amilcar R. Arvelo ,  Evan G. Colgan ,  John H. Magerlein ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Jamil A. Wakil ,  Xiaojin Wei ,  Jeffrey A. Zitz

IPC分类号： H01L23/36

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L23/10 ,  H01L23/42 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2924/00

摘要： An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.

摘要翻译： 提供了一种用于减少在计算环境中使用的三维（3D）裸片堆栈的热惩罚的装置，并且包括安装在计算环境内的基板，执行计算环境的操作的第一部件，其耦合到 所述基板在堆叠方向上，一组第二部件，用于执行所述计算环境的操作，每个部件耦合到所述第一部件并相对于彼此分割以形成空出的区域;布置在所述热界面材料（TIM） 在第一和第二部件的暴露的表面上，以及包括突起的盖，其连接到基板以覆盖第一和第二部件，使得突起延伸到空出的区域中，并且使得盖和突起的表面热连通 第一和第二组件通过TIM。

公开(公告)号：US20100019377A1

公开(公告)日：2010-01-28

申请号：US12177194

申请日：2008-07-22

申请人： Amilcar R. Arvelo ,  Evan G. Colgan ,  John H. Magerlein ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Jamil A. Wakil ,  Xiaojin Wei ,  Jeffrey A. Zitz

发明人： Amilcar R. Arvelo ,  Evan G. Colgan ,  John H. Magerlein ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Jamil A. Wakil ,  Xiaojin Wei ,  Jeffrey A. Zitz

IPC分类号： H01L23/36

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L23/10 ,  H01L23/42 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2924/00

摘要： An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.

摘要翻译： 提供了一种用于减少在计算环境中使用的三维（3D）裸片堆栈的热惩罚的装置，并且包括安装在计算环境内的基板，执行计算环境的操作的第一部件，其耦合到 所述基板在堆叠方向上，一组第二部件，用于执行所述计算环境的操作，每个部件耦合到所述第一部件并相对于彼此分割以形成空出的区域;布置在所述热界面材料（TIM） 在第一和第二部件的暴露的表面上，以及包括突起的盖，其连接到基板以覆盖第一和第二部件，使得突起延伸到空出的区域中，并且使得盖和突起的表面热连通 第一和第二组件通过TIM。

公开(公告)号：US07031162B2

公开(公告)日：2006-04-18

申请号：US10672494

申请日：2003-09-26

申请人： Amilcar R. Arvelo ,  Kamal Kumar Sikka ,  Hilton T. Toy

发明人： Amilcar R. Arvelo ,  Kamal Kumar Sikka ,  Hilton T. Toy

IPC分类号： H01L23/34 ,  H01L23/40 ,  H05K7/20

CPC分类号： H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/16152

摘要： Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.

摘要翻译： 公开了一种冷却结构，其具有安装在芯片上的单独的散热器或盖。 大功率撒布机或盖帽的厚度超过了较低功率的撒布机的厚度，以确保高功率撒布机达到最高平面并与具有最小界面间隙的散热器配合。 低功率撒布机和散热器底座之间的可变和更高的间隙由可压缩的热垫或油脂材料容纳。