-
公开(公告)号：US20210288010A1
公开(公告)日：2021-09-16
申请号：US17193478
申请日：2021-03-05
发明人： Gyu Wan Han , Jin Seong Kim , Byong Woo Cho
摘要： An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices manufactured thereby, that comprise utilizing a compressed interconnection structure (e.g., a compressed solder ball, etc.) in an encapsulating process to form an aperture in an encapsulant. The compressed interconnection structure may then be reformed in the aperture.
-
公开(公告)号：US12107035B2
公开(公告)日：2024-10-01
申请号：US17897556
申请日：2022-08-29
发明人： Jae Yun Kim , Gi Tae Lim , Woon Kab Jung , Ju Hoon Yoon , Dong Joo Park , Byong Woo Cho , Gyu Wan Han , Ji Young Chung , Jin Seong Kim , Do Hyun Na
IPC分类号： H01L23/498 , H01L21/50 , H01L23/00 , H01L23/31 , H01L23/538
CPC分类号： H01L23/49811 , H01L21/50 , H01L23/3128 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/92 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/16227 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73253 , H01L2224/81815 , H01L2224/83191 , H01L2224/83203 , H01L2224/8321 , H01L2224/92225 , H01L2224/92242 , H01L2924/181 , H01L2924/18161 , H01L2224/81815 , H01L2924/00014 , H01L2224/8321 , H01L2924/00014 , H01L2224/83203 , H01L2924/00014 , H01L2224/2929 , H01L2924/0665 , H01L2224/2919 , H01L2924/0665 , H01L2224/293 , H01L2924/00014 , H01L2224/92242 , H01L2224/81 , H01L2924/181 , H01L2924/00 , H01L2224/131 , H01L2924/014 , H01L2224/1329 , H01L2924/00014 , H01L2224/133 , H01L2924/00014
摘要： A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
-
公开(公告)号：US20220415769A1
公开(公告)日：2022-12-29
申请号：US17897556
申请日：2022-08-29
发明人： Jae Yun Kim , Gi Tae Lim , Woon Kab Jung , Ju Hoon Yoon , Dong Joo Park , Byong Woo Cho , Gyu Wan Han , Ji Young Chung , Jin Seong Kim , Do Hyun Na
IPC分类号： H01L23/498 , H01L23/31 , H01L21/50 , H01L23/00 , H01L23/538
摘要： A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
-
公开(公告)号：US11049828B2
公开(公告)日：2021-06-29
申请号：US15078474
申请日：2016-03-23
发明人： Gyu Wan Han , Jin Seong Kim , Byong Woo Cho
摘要： An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices manufactured thereby, that comprise utilizing a compressed interconnection structure (e.g., a compressed solder ball, etc.) in an encapsulating process to form an aperture in an encapsulant. The compressed interconnection structure may then be reformed in the aperture.
-
5.发明申请公开(公告)号：US20210296263A1
公开(公告)日：2021-09-23
申请号：US17340317
申请日：2021-06-07
发明人： Jin Seong Kim , Byong Woo Cho , Cha Gyu Song
IPC分类号： H01L23/00
摘要： A semiconductor die package includes a semiconductor die, a film for improving die warpage bonded to a first face of the semiconductor die, a plurality of electrically conductive bumps formed on a second face of the semiconductor die, a substrate onto which the electrically conductive bumps of the second face of the semiconductor die are bonded to electrically connect the semiconductor die and the substrate, and a mold compound applied these components to form an exposed surface of the semiconductor die package that is coplanar with an exposed surface of the film.
-
6.发明授权公开(公告)号：US11031356B2
公开(公告)日：2021-06-08
申请号：US16707411
申请日：2019-12-09
发明人： Jin Seong Kim , Byong Woo Cho , Cha Gyu Song
摘要： A semiconductor die package includes a semiconductor die, a film for improving die warpage bonded to a first face of the semiconductor die, a plurality of electrically conductive bumps formed on a second face of the semiconductor die, a substrate onto which the electrically conductive bumps of the second face of the semiconductor die are bonded to electrically connect the semiconductor die and the substrate, and a mold compound applied these components to form an exposed surface of the semiconductor die package that is coplanar with an exposed surface of the film.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.014 秒)
