摘要:
In a first method of erasing a resistive memory device, an electrical potential is applied to the gate of a transistor in series with the resistive memory device, and successive increasing currents are provided through the resistive memory device by means of providing successive increasing electrical potentials across the resistive memory device. In a second method of erasing a resistive memory device, an electrical potential is applied across the resistive memory device, and successive increasing currents are provided through the resistive memory device by means of providing successive increasing electrical potentials to the gate of a transistor in series with the resistive memory device.
摘要:
In a first method of erasing a resistive memory device, an electrical potential is applied to the gate of a transistor in series with the resistive memory device, and successive increasing currents are provided through the resistive memory device by means of providing successive increasing electrical potentials across the resistive memory device. In a second method of erasing a resistive memory device, an electrical potential is applied across the resistive memory device, and successive increasing currents are provided through the resistive memory device by means of providing successive increasing electrical potentials to the gate of a transistor in series with the resistive memory device.
摘要:
In the method of fabricating a metal-insulator-metal (MIM) device, a first electrode of α-Ta is provided. The Ta of the first electrode is oxidized to form a Ta2O5 layer on the first electrode. A second electrode of β-Ta is provided on the Ta2O5 layer. Such a device exhibits strong data retention, along with resistance to performance degradation under high temperatures.
摘要翻译:在制造金属 - 绝缘体 - 金属(MIM)器件的方法中,提供了α-Ta的第一电极。 在第一电极上氧化第一电极的Ta以形成Ta 2 O 5 O 5层。 β-Ta的第二电极设置在Ta 2 O 5层上。 这种器件表现出强大的数据保持性,同时耐高温下的性能降解。
摘要:
In the present method of programming a memory device from an erased state, the memory device includes first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrodes. In the programming method, (i) an electrical potential is applied across the first and second electrodes from higher to lower potential in one direction to reduce the resistance of the memory device, and (ii) an electrical potential is applied across the first and second electrodes from higher to lower potential in the other direction to further reduce the resistance of the memory device.
摘要:
In the method of fabricating a metal-insulator-metal (MIM) device, a first electrode of α-Ta is provided. The Ta of the first electrode is oxidized to form a Ta2O5 layer on the first electrode. A second electrode of β-Ta is provided on the Ta2O5 layer. Such a device exhibits strong data retention, along with resistance to performance degradation under high temperatures.
摘要翻译:在制造金属 - 绝缘体 - 金属(MIM)器件的方法中,提供了α-Ta的第一电极。 在第一电极上氧化第一电极的Ta以形成Ta 2 O 5 O 5层。 β-Ta的第二电极设置在Ta 2 O 5层上。 这种器件表现出强大的数据保持性,同时耐高温下的性能降解。
摘要:
In a first method of writing data to a resistive memory device (i.e. programming or erasing), successive electrical potentials are applied across the resistive memory device, wherein the successive electrical potentials are of increasing duration. In another method of writing data to a resistive memory device (i.e. programming or erasing), an electrical potential is applied across the resistive memory device, and the level of current through the memory device is sensed as the electrical potential is applied. The application of the electrical potential is ended based on a selected level of current through the resistive memory device.
摘要:
In a first method of writing data to a resistive memory device (i.e. programming or erasing), successive electrical potentials are applied across the resistive memory device, wherein the successive electrical potentials are of increasing duration. In another method of writing data to a resistive memory device (i.e. programming or erasing), an electrical potential is applied across the resistive memory device, and the level of current through the memory device is sensed as the electrical potential is applied. The application of the electrical potential is ended based on a selected level of current through the resistive memory device.