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公开(公告)号：US20240334584A1
公开(公告)日：2024-10-03
申请号：US18191327
申请日：2023-03-28
Inventor： Romulo Maggay
CPC classification number: H05H1/4645 , H05K1/16 , H05K2201/09381 , H05K2201/09409 , H05K2201/0949 , H05K2201/10053
Abstract: Apparatus and methods for nanoplasma switches are disclosed. In certain embodiments, a nanoplasma switching system includes a nanoplasma radio frequency (RF) switch that receives an RF signal, and a nanoplasma DC switch that receives a DC bias voltage. The nanoplasma DC switch is positioned adjacent to but spaced apart from the nanoplasma RF switch. The nanoplasma DC switch induces a nanoplasma through the nanoplasma RF switch when the DC bias voltage is set to a first voltage level. By implementing the nanoplasma switching system in this manner, DC bias to turn on or off the nanoplasma RF switch can be realized without needing to use passive components such as DC blocking capacitors, choke inductors, or baluns for isolation.
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公开(公告)号：US12267940B2
公开(公告)日：2025-04-01
申请号：US18191327
申请日：2023-03-28
Inventor： Romulo Maggay
Abstract: Apparatus and methods for nanoplasma switches are disclosed. In certain embodiments, a nanoplasma switching system includes a nanoplasma radio frequency (RF) switch that receives an RF signal, and a nanoplasma DC switch that receives a DC bias voltage. The nanoplasma DC switch is positioned adjacent to but spaced apart from the nanoplasma RF switch. The nanoplasma DC switch induces a nanoplasma through the nanoplasma RF switch when the DC bias voltage is set to a first voltage level. By implementing the nanoplasma switching system in this manner, DC bias to turn on or off the nanoplasma RF switch can be realized without needing to use passive components such as DC blocking capacitors, choke inductors, or baluns for isolation.
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公开(公告)号：US11929542B2
公开(公告)日：2024-03-12
申请号：US17218084
申请日：2021-03-30
Inventor： Romulo Maggay
CPC classification number: H01Q1/2283 , H01L23/49822 , H01L23/66 , H01Q1/38 , H01Q1/40 , H01Q9/0407 , H01Q23/00 , H01L2223/6677
Abstract: System in package (SiP) modules are compact packages that include components such as processors, memory, sensors, and passive components on a single substrate. One low cost and compact way to integrate an antenna into a SiP module is to suspend an antenna in molding compound so that the antenna is embedded in the real estate of the molding compound layer. To embed the antenna, the molding compound is first deposited. A cavity can be cut in the molding compound to hold the antenna. The cavity can be filled with conductive material to form the antenna. Further molding compound can be deposited to cover the antenna and enclose the antenna in the molding compound layer. Ground structures can also be suspended in the molding compound. Such an embedded antenna can be particularly useful for radio applications.
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公开(公告)号：US10978779B2
公开(公告)日：2021-04-13
申请号：US16132786
申请日：2018-09-17
Inventor： Romulo Maggay
Abstract: System in package (SIP) modules are compact packages that include components such as processors, memory, sensors, and passive components on a single substrate. One low cost and compact way to integrate an antenna into a SIP module is to suspend an antenna in molding compound so that the antenna is embedded in the real estate of the molding compound layer. To embed the antenna, the molding compound is first deposited. A cavity can be cut in the molding compound to hold the antenna. The cavity can be filled with conductive material to form the antenna. Further molding compound can be deposited to cover the antenna and enclose the antenna in the molding compound layer. Ground structures can also be suspended in the molding compound. Such an embedded antenna can be particularly useful for radio applications.
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