公开(公告)号：US08779532B2

公开(公告)日：2014-07-15

申请号：US13767214

申请日：2013-02-14

Applicant: Analog Devices Technology

Inventor： Alan J. O'Donnell ,  Michael J. Cusack ,  Rigan F. McGeehan ,  Garrett A. Griffin

IPC: H01L27/14

CPC classification number: B81B3/0018 ,  B81C1/0023 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/81

Abstract: Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.

Abstract translation: 基座构件中的背面凹部主体部件，例如传感器或电路，以允许更接近并有效地使用表面空间和基部构件的内部体积。 凹槽可以包括盖子，帽子，滤镜和透镜，并且可以与基座的前侧上的电路或主动背面盖上的电路连通。 一系列凹陷部件可以形成完整，紧凑的传感器系统。

公开(公告)号：US20150123256A1

公开(公告)日：2015-05-07

申请号：US14072572

申请日：2013-11-05

Applicant: Analog Devices Technology

Inventor： Oliver J Kierse ,  Frank Poucher ,  Michael J. Cusack ,  Padraig L. Fitzgerald ,  Patrick Elebert

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/16 ,  H01L23/295 ,  H01L23/31 ,  H01L23/3107 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A stress shield for a plastic integrated circuit package is disclosed. A shield plate is attached by an adhesive to a top surface of an integrated circuit die such that the shield plate covers less than all of the top surface and leaves bond pads exposed. A molding material is applied over the shield plate and the integrated circuit die. The shield plate shields the integrated circuit die from stresses imparted by the molding material.

Abstract translation: 公开了一种塑料集成电路封装的应力屏蔽。 屏蔽板通过粘合剂附接到集成电路管芯的顶表面，使得屏蔽板覆盖小于所有顶表面并且留下暴露的接合焊盘。 将模制材料施加在屏蔽板和集成电路模具上。 屏蔽板屏蔽集成电路模具与模制材料施加的应力。