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    Wafer inspection
    1.
    发明授权
    Wafer inspection 有权
    晶圆检查

    公开(公告)号：US09279774B2

    公开(公告)日：2016-03-08

    申请号：US13544954

    申请日：2012-07-09

    申请人： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

    发明人： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

    IPC分类号： G01N21/00 ,  G01N21/95 ,  G01N21/47 ,  G01N21/956

    CPC分类号： G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

    摘要： Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to simultaneously form multiple illumination areas on the wafer with substantially no illumination flux between each of the areas. The system also includes a scanning subsystem configured to scan the multiple illumination areas across the wafer. In addition, the system includes a collection subsystem configured to simultaneously and separately image light scattered from each of the areas onto two or more sensors. Characteristics of the two or more sensors are selected such that the scattered light is not imaged into gaps between the two or more sensors. The two or more sensors generate output responsive to the scattered light. The system further includes a computer subsystem configured to detect defects on the wafer using the output of the two or more sensors.

    摘要翻译： 提供了配置用于检查晶片的系统。 一个系统包括照明子系统，该照明子系统配置成在晶片上同时形成多个照明区域，其中每个区域之间基本上没有照明通量。 该系统还包括扫描子系统，被配置为扫描晶片上的多个照明区域。 另外，该系统包括一个收集子系统，该收集子系统配置成同时并分别将从每个区域散射的光分别映射到两个或更多个传感器上。 选择两个或更多个传感器的特征，使得散射光不被成像到两个或更多个传感器之间的间隙中。 两个或多个传感器响应散射光产生输出。 该系统还包括被配置为使用两个或更多个传感器的输出来检测晶片上的缺陷的计算机子系统。

    Extended defect sizing range for wafer inspection
    3.
    发明授权
    Extended defect sizing range for wafer inspection 有权
    晶圆检查扩展缺陷尺寸范围

    公开(公告)号：US09091666B2

    公开(公告)日：2015-07-28

    申请号：US13369294

    申请日：2012-02-09

    申请人： Zhongping Cai ,  Yury Yuditsky ,  Anatoly Romanovsky ,  Alexander Slobodov

    发明人： Zhongping Cai ,  Yury Yuditsky ,  Anatoly Romanovsky ,  Alexander Slobodov

    IPC分类号： G01N21/88 ,  G01N21/95

    CPC分类号： G01N21/9501

    摘要： Various embodiments for extended defect sizing range for wafer inspection are provided. One inspection system includes an illumination subsystem configured to direct light to the wafer. The system also includes an image sensor configured to detect light scattered from wafer defects and to generate output responsive to the scattered light. The image sensor is also configured to not have an anti-blooming feature such that when a pixel in the image sensor reaches full well capacity, excess charge flows from the pixel to one or more neighboring pixels in the image sensor. The system further includes a computer subsystem configured to detect the defects on the wafer using the output and to determine a size of the defects on the wafer using the output generated by a pixel and any neighboring pixels of the pixel to which the excess charge flows.

    摘要翻译： 提供了用于晶片检查的扩展缺陷尺寸范围的各种实施例。 一个检查系统包括配置成将光引导到晶片的照明子系统。 该系统还包括图像传感器，其被配置为检测从晶片缺陷散射的光并且响应于散射光产生输出。 图像传感器还被配置为不具有防喷射特征，使得当图像传感器中的像素达到满井容量时，过量电荷从图像传感器中的像素流向一个或多个相邻像素。 该系统还包括被配置为使用输出来检测晶片上的缺陷的计算机子系统，并且使用由像素和多余电荷流过的像素的任何相邻像素产生的输出来确定晶片上的缺陷的尺寸。