公开(公告)号：US20120210012A1

公开(公告)日：2012-08-16

申请号：US13339300

申请日：2011-12-28

申请人： Andreas Jansson ,  Grant Yang ,  Jack Li ,  Vicky Liu ,  Tao Ma ,  Peng Liu ,  Ting Lou ,  Zun Wu ,  Yan Gao

发明人： Andreas Jansson ,  Grant Yang ,  Jack Li ,  Vicky Liu ,  Tao Ma ,  Peng Liu ,  Ting Lou ,  Zun Wu ,  Yan Gao

IPC分类号： G06F15/16

CPC分类号： H04L67/2809

摘要： In accordance with various embodiments, a set of features are described for enabling an application server platform for telecom based applications. A system for providing an application server for telecom-based applications can include an application server that includes a session initiation protocol (SIP) adapter. The SIP adapter can use a connection oriented protocol and provides interactions with application code in an actor of said application server by means of asynchronized SIP protocol events. The SIP adapter can also provide stateless node mapping to a stateful server node hosting a specific session for the actor.

摘要翻译： 根据各种实施例，描述了一组功能，用于启用用于基于电信的应用的应用服务器平台。 用于为基于电信的应用提供应用服务器的系统可以包括包括会话发起协议（SIP）适配器的应用服务器。 SIP适配器可以使用面向连接的协议，并且通过异步SIP协议事件提供与所述应用服务器的演员中的应用代码的交互。 SIP适配器还可以向托管运行者的特定会话的状态服务器节点提供无状态节点映射。

公开(公告)号：US09258379B2

公开(公告)日：2016-02-09

申请号：US13339300

申请日：2011-12-28

申请人： Andreas Jansson ,  Grant Yang ,  Jack Li ,  Vicky Liu ,  Tao Ma ,  Peng Liu ,  Ting Lou ,  Zun Wu ,  Yun Gao

发明人： Andreas Jansson ,  Grant Yang ,  Jack Li ,  Vicky Liu ,  Tao Ma ,  Peng Liu ,  Ting Lou ,  Zun Wu ,  Yun Gao

IPC分类号： G06F15/16 ,  H04L29/08

CPC分类号： H04L67/2809

摘要： In accordance with various embodiments, a set of features are described for enabling an application server platform for telecom based applications. A system for providing an application server for telecom-based applications can include an application server that includes a session initiation protocol (SIP) adapter. The SIP adapter can use a connection oriented protocol and provides interactions with application code in an actor of said application server by means of asynchronized SIP protocol events. The SIP adapter can also provide stateless node mapping to a stateful server node hosting a specific session for the actor.

摘要翻译： 根据各种实施例，描述了一组功能，用于启用用于基于电信的应用的应用服务器平台。 用于为基于电信的应用提供应用服务器的系统可以包括包括会话发起协议（SIP）适配器的应用服务器。 SIP适配器可以使用面向连接的协议，并且通过异步SIP协议事件提供与所述应用服务器的演员中的应用代码的交互。 SIP适配器还可以向托管运行者的特定会话的状态服务器节点提供无状态节点映射。

公开(公告)号：US06265763B1

公开(公告)日：2001-07-24

申请号：US09524944

申请日：2000-03-14

申请人： Jui-Meng Jao ,  Eric Ko ,  Vicky Liu

发明人： Jui-Meng Jao ,  Eric Ko ,  Vicky Liu

IPC分类号： H01L23495

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip IC package for central pad chips is proposed, which can be used to pack one peripheral-pad IC chip and at least one central-pad IC chip therein. The multi-chip IC package includes a specially-designed lead frame having a central die pad and a lead portion separated from the central die pad by a gap. The central-pad IC chip is partly attached to the lead portion of the lead frame and partly attached to the central die pad of the lead frame such that the central pads on the central-pad IC chip can be aligned with the gap of lead frame so as to allow bonding wires electrically connecting the central-pad IC chip with the lead portion of the lead frame to pass therethrough. The characterized package allows the bonding wires applied to the central-pad IC chip to be short in length so as to retain IC performance and save manufacture cost, making this multi-chip IC package structure more advantageous to use than the prior art.

摘要翻译： 提出了一种用于中心焊盘芯片的多芯片IC封装，其可用于在其中封装一个外围焊盘IC芯片和至少一个中心焊盘IC芯片。 多芯片IC封装包括一个特别设计的引线框架，其具有中央管芯焊盘和引线部分，该引线部分通过间隙与中心管芯焊盘分离。 中心焊盘IC芯片部分地附接到引线框架的引线部分并且部分地附接到引线框架的中心管芯焊盘，使得中心焊盘IC芯片上的中心焊盘可以与引线框架的间隙对准 以使得将中心焊盘IC芯片与引线框架的引线部分电连接的接合线通过。 特征在于的封装允许施加到中心焊盘IC芯片的接合线的长度短，从而保持IC性能并节省制造成本，使得该多芯片IC封装结构比现有技术更有利。

公开(公告)号：US06552428B1

公开(公告)日：2003-04-22

申请号：US09416314

申请日：1999-10-12

申请人： Chien Ping Huang ,  Tom Tang ,  Kevin Chiang ,  Jenq-Yuan Lai ,  Candy Tien ,  Vicky Liu

发明人： Chien Ping Huang ,  Tom Tang ,  Kevin Chiang ,  Jenq-Yuan Lai ,  Candy Tien ,  Vicky Liu

IPC分类号： H01L2310

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package with an exposed heat spreader includes a substrate having a semiconductor chip adhered to a first surface of the substrate. The heat spreader includes an upper portion, a lower portion with an opening formed in the center for receiving the semiconductor chip, and a connecting portion for connecting the upper portion and the lower portion in a manner that the upper portion is raised to a height above the opening of the lower portion. The lower portion is formed with a plurality of positioning members outwardly extending from edges of the lower portion to prevent the heat spreader from being dislocated during a molding process, and further includes downward flutes formed on the periphery of the opening for enabling resin flow underneath the heat spreader. The upper portion of the heat spreader is exposed to an exterior of the semiconductor package to improve heat dissipation.

摘要翻译： 具有暴露的散热器的半导体封装包括具有粘附到基板的第一表面的半导体芯片的基板。 散热器包括上部，具有形成在用于容纳半导体芯片的中心的开口的下部，以及用于连接上部和下部的连接部分，其上部部分被升高到上方的高度 下部的开口。 下部形成有从下部的边缘向外延伸的多个定位构件，以防止在模制过程中散热器脱位，并且还包括形成在开口的周边上的向下的凹槽，以使树脂在下面的流动 散热器 散热器的上部暴露于半导体封装的外部，以改善散热。

公开(公告)号：US06246115B1

公开(公告)日：2001-06-12

申请号：US09425145

申请日：1999-10-21

申请人： Tom Tang ,  Chien Ping Huang ,  Kevin Chiang ,  Jeng-Yuan Lai ,  Candy Tien ,  Vicky Liu

发明人： Tom Tang ,  Chien Ping Huang ,  Kevin Chiang ,  Jeng-Yuan Lai ,  Candy Tien ,  Vicky Liu

IPC分类号： H01L2310

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit package with a fully-exposed heat sink is provided. The integrated circuit package includes a substrate having a first side being formed with first conductive traces and a second side being formed with second conductive traces. At least one chip is mounted on the substrate and electrically connected to the first conductive traces. A plurality of solder balls are provided at the terminal ends of the second conductive traces to allow external connection of the chip. The fully-exposed heat sink is mounted on the substrate. The heat sink is formed with a plurality of supportive legs arranged in such a manner as to allow a bottom surface of the heat sink to be separated from the chip and a top surface of the heat sink to be tightly attached to a cavity in a mold used to form an encapsulant for enclosing the chip. A plurality of positioning tongues are formed on the heat sink for securing the heat sink in position when performing a molding process for forming the encapsulant. With this integrated circuit package, no jig is required in the assembly of the integrated circuit package. Moreover, since there is no need to use adhesives to adhere the supportive legs onto the substrate, the integrated circuit package would not suffer from delamination as in the case of the prior art. The fully-exposed heat sink allows an increased heat-dissipating efficient as compared to the prior art.

摘要翻译： 提供了一个具有完全暴露的散热器的集成电路封装。 集成电路封装包括具有形成有第一导电迹线的第一侧的基板，和形成有第二导电迹线的第二侧。 至少一个芯片安装在基板上并电连接到第一导电迹线。 多个焊球设置在第二导电迹线的末端，以允许芯片的外部连接。 完全曝光的散热器安装在基板上。 散热器形成有多个支撑腿，其布置成允许散热器的底表面与芯片分离，并且散热器的顶表面紧密地附接到模具中的空腔中 用于形成封装芯片的密封剂。 多个定位舌片形成在散热器上，用于在执行用于形成密封剂的成型工艺时将散热器固定就位。 使用该集成电路封装，集成电路封装的组装中不需要夹具。 此外，由于不需要使用粘合剂将支撑腿粘附到基板上，所以与现有技术的情况相同，集成电路封装不会遭受分层。 与现有技术相比，完全暴露的散热器允许增加散热效率。