摘要:
Activators for heat-curing epoxy resin compositions, as well as use thereof in heat-curing epoxy resin compositions. These activators are distinguished by a good activation effect as well as good storage stability.
摘要:
Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability.
摘要:
A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.
摘要:
Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability.
摘要:
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
摘要:
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin with, on average, more than one epoxide group per molecule, at least one curing agent for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer. Said epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
摘要:
A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described.
摘要:
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin with, on average, more than one epoxide group per molecule, at least one curing agent for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer. Said epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
摘要:
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
摘要:
The present invention concerns low-odor, low-viscosity hardeners for epoxy resins, including an amine with at least one amino group of formula (I) and an amine with at least one amino group of formula (II), wherein the amino groups of formulas (I) and (II) are present in a particular ratio. These hardeners harden quickly with epoxy resins and without blushing to form films of high hardness and good resistance. They are especially suitable for low-emission coatings.