摘要:
The present invention relates to heat-curing epoxy resin compositions, which are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.
摘要:
The invention relates to differently blocked polyurethane polymers of formula, to their use as impact resistance modifiers, to heat-curable epoxy resin compositions containing said impact resistance modifiers and to methods for the production of said compositions. The invention also relates to bonding methods using said compositions and to articles produced by said methods.
摘要:
The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (I), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.
摘要:
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
摘要:
The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.
摘要:
Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.
摘要:
Described are heat hardening compounds which contain at least one epoxy resin, A, with on average more than one epoxy group per molecule, at least one impact-strength modifier, B, at least one crack promoter, C, as well as at least one hardener, D, for epoxy resin, which is activated by raised temperature. Silicate layers such as mica or talc and graphite are particularly suitable as crack promoters, C.