公开(公告)号：US06985359B2

公开(公告)日：2006-01-10

申请号：US10419406

申请日：2003-04-21

申请人： Andrew D. Delano ,  Bradley E. Clements ,  Brandon A. Rubenstein

发明人： Andrew D. Delano ,  Bradley E. Clements ,  Brandon A. Rubenstein

IPC分类号： H05K7/21

CPC分类号： H01L23/4338 ,  F28F13/00 ,  F28F2013/008 ,  H01L2924/0002 ,  H01L2924/00

摘要： A variable-gap thermal-interface device for transferring heat from a heat source to a heat sink is provided. The device comprises a multi-axis rotary spherical joint comprising a spherically concave surface having a first radius of curvature in slideable contact with a spherically convex surface having the same first radius of curvature. The device further comprises a block having a proximal end rotatably coupled with the heat sink through the rotary spherical joint and having a distal end opposite the proximal end. The device further comprises a wedge having a variable thickness separating a first surface and a second surface opposite and inclined relative to the first surface, such that the first surface is thermally coupled with the distal end of the block, and the second surface is thermally coupled with the heat source.

摘要翻译： 提供了一种用于将热量从热源传递到散热器的可变间隙热接口装置。 该装置包括多轴旋转球形接头，其包括具有第一曲率半径的球形凹面，其具有与具有相同的第一曲率半径的球形凸起表面可滑动接触。 该装置还包括具有通过旋转球形接头可旋转地与散热器连接并具有与近端相对的远端的近端的块体。 该装置还包括具有可变厚度的楔块，该第一表面和第二表面相对于第一表面相对且相对并且相对于第一表面倾斜，使得第一表面与块的远端热耦合，并且第二表面被热耦合 与热源。

公开(公告)号：US07480143B2

公开(公告)日：2009-01-20

申请号：US10419373

申请日：2003-04-21

申请人： Andrew D. Delano ,  Brandon A. Rubenstein ,  Eugene Miksch

发明人： Andrew D. Delano ,  Brandon A. Rubenstein ,  Eugene Miksch

IPC分类号： H05K7/20

CPC分类号： H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of transferring heat from a heat source to a heat sink using a variable-gap thermal-interface device is provided. The method comprises providing and rotating a multi-axis rotary spherical joint to an orientation to compensate for misalignment between the heat source and heat sink. The method further comprises providing a shim of thickness sufficient to fill a gap between the heat source and multi-axis rotary spherical joint, and inserting the shim to fill the gap.

摘要翻译： 提供了使用可变间隙热接口装置将热量从热源传递到散热器的方法。 该方法包括提供和旋转多轴旋转球形接头到取向以补偿热源和散热器之间的不对准。 该方法还包括提供足以填充热源和多轴旋转球形接头之间的间隙的厚度的垫片，以及插入垫片以填充间隙。

公开(公告)号：US07344384B2

公开(公告)日：2008-03-18

申请号：US10972688

申请日：2004-10-25

申请人： Brandon Aaron Rubenstein ,  Andrew D. Delano ,  Bradley E. Clements

发明人： Brandon Aaron Rubenstein ,  Andrew D. Delano ,  Bradley E. Clements

IPC分类号： H01R12/00

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： Systems, methodologies, methods of manufacture, and other embodiments associated with semiconductor/processor module assemblies are described. One exemplary system embodiment includes a bolster plate assembly for a semiconductor module assembly that includes a bolster plate and a leaf spring pre-loaded onto the bolster plate. The example system may also include the leaf spring being releasably attached to the bolster plate and positioned to provide a force in a direction generally away from the bolster plate. The leaf spring can be configured to release from the bolster plate upon attaching the semiconductor module assembly to the bolster plate that causes the leaf spring to exert the force in the direction generally away from the bolster plate and against a semiconductor module assembly.

摘要翻译： 描述了与半导体/处理器模块组件相关联的系统，方法，制造方法和其它实施例。 一个示例性系统实施例包括用于半导体模块组件的垫板组件，其包括垫板和预加载到垫板上的板簧。 示例性系统还可以包括可释放地附接到垫板上并且定位成沿通常远离垫板的方向提供力的板簧。 板簧可以被配置成在将半导体模块组件附接到垫板上时从垫板释放，该板簧使得板簧沿大致远离垫板的方向和半导体模块组件施加力。

公开(公告)号：US20140041827A1

公开(公告)日：2014-02-13

申请号：US13570073

申请日：2012-08-08

申请人： Edward C. Giaimo, III ,  Yi He ,  Robert D. Young ,  Andrew D. Delano

发明人： Edward C. Giaimo, III ,  Yi He ,  Robert D. Young ,  Andrew D. Delano

IPC分类号： F28F27/00

CPC分类号： G06F1/203 ,  G06F1/3234

摘要： Techniques involving management of a heat transfer device are described. In one or more implementations, a device includes a housing, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a powered active cooling device. The device also includes one or more modules that are configured to adjust operation of the powered active cooling device based on a likely orientation of the heat transfer device.

摘要翻译： 描述了涉及管理传热装置的技术。 在一个或多个实施方案中，装置包括壳体，设置在壳体内的发热装置和设置在壳体内的传热装置。 传热装置具有动力主动冷却装置。 该装置还包括一个或多个模块，其被配置为基于热传递装置的可能取向来调节动力主动冷却装置的操作。

公开(公告)号：US20080050974A1

公开(公告)日：2008-02-28

申请号：US11510986

申请日：2006-08-27

申请人： Andrew D. Delano

发明人： Andrew D. Delano

IPC分类号： H01R24/00

CPC分类号： H01R24/60 ,  H01R2107/00

摘要： A multi-directional electrical interconnect device having mating male and female terminals disposed in, attached to, or coupled to male and female housings. The housings and terminals are configured to allow mating at any angle between two orthogonal directions, i.e., from either of two directions that are disposed at 90 degrees relative to one another, or any angle therebetween.

摘要翻译： 一种多向电气互连装置，其具有设置在，连接到或联接到阳壳体和阴壳体上的配合阳和阴端子。 壳体和端子构造成允许在两个正交方向之间的任何角度配合，即从相对于彼此以90度设置的两个方向之一或其间的任何角度。

公开(公告)号：US07120023B2

公开(公告)日：2006-10-10

申请号：US10649518

申请日：2003-08-25

申请人： Joseph M. Whit ,  Andrew D. Delano

发明人： Joseph M. Whit ,  Andrew D. Delano

IPC分类号： H05K7/20

CPC分类号： H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： A variable-height thermal-interface assembly for transferring heat from a heat source to a heat sink comprises a slidable interface between two contacting surfaces, the slidable interface inclined diagonally relative to the z-axis. The two contacting surfaces slide relative to one another parallel to the incline direction to provide z-axis expansion of the assembly. The assembly further comprises a spring clip, which when released applies a shear force across the slidable interface, causing the two contacting surfaces to slide relative to one another, coupling the sliding to provide z-axis expansion. The assembly further comprises a reversible locking device, which when locked prevents the two contacting surfaces from sliding relative to one another, such that the spring clip remains retracted, and when unlocked allows the two contacting surfaces to slide relative to one another, such that the spring clip is released.

摘要翻译： 用于将热量从热源传递到散热器的可变高度热接口组件包括在两个接触表面之间的可滑动界面，所述可滑动界面相对于z轴倾斜地倾斜。 两个接触表面相对于彼此平行于倾斜方向相互滑动以提供组件的z轴膨胀。 组件还包括弹簧夹，当释放时，剪切力穿过可滑动界面施加剪切力，导致两个接触表面相对于彼此滑动，将滑动联接以提供z轴扩张。 该组件还包括可逆锁定装置，其在锁定时防止两个接触表面相对于彼此滑动，使得弹簧夹保持缩回，并且当解锁时允许两个接触表面相对于彼此滑动，使得 弹簧夹被释放。

公开(公告)号：US20100129648A1

公开(公告)日：2010-05-27

申请号：US12323913

申请日：2008-11-26

申请人： Jun Xu ,  Andrew D. Delano

发明人： Jun Xu ,  Andrew D. Delano

IPC分类号： B32B27/32 ,  B32B9/04 ,  H05K3/10

CPC分类号： H01L23/4275 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/49155 ,  Y10T428/269 ,  Y10T428/31667 ,  Y10T428/31801 ,  H01L2924/00

摘要： Electronic components described herein include a heat generating component surface; a heat sink having a top surface and a bottom surface; and a thermal interface material comprising a phase change material, wherein the heat generating component surface is coupled to the bottom surface of the heat sink by the thermal interface material. Methods of forming an electronic component include: a) providing a heat-generating component surface; b) providing at least one thermal interface material; c) providing a heat sink component having a top surface and a bottom surface; d) depositing the at least one thermal interface material onto at least part of at least one of the surfaces of the heat sink component, and e) coupling the surface of the heat sink component with the thermal interface material layer with the heat generating component surface to produce the electronic component.

摘要翻译： 本文所述的电子部件包括发热部件表面; 具有顶表面和底表面的散热器; 以及包含相变材料的热界面材料，其中所述发热部件表面通过所述热界面材料联接到所述散热器的底表面。 形成电子部件的方法包括：a）提供发热部件表面; b）提供至少一种热界面材料; c）提供具有顶表面和底表面的散热器部件; d）将至少一个热界面材料沉积在散热部件的至少一个表面的至少一部分上，以及e）将散热部件的表面与热界面材料层与发热部件表面 以生产电子部件。

公开(公告)号：US20100112360A1

公开(公告)日：2010-05-06

申请号：US12262704

申请日：2008-10-31

申请人： Andrew D. Delano

发明人： Andrew D. Delano

IPC分类号： B32B15/04 ,  C23C28/00

CPC分类号： H01L23/42 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： A layered thermal interface system is described herein that comprises: at least one deposition layer of metal, at least one layer of thermal interface material, at least one plated layer of metal, and at least one heat spreader. Another layered thermal interface system is described herein that comprises: a silicon layer, at least one deposition layer of metal, at least one layer of thermal interface material, at least one plated layer of metal, and at least one heat spreader Methods of forming contemplated layered thermal system comprise: a) providing at least one deposition layer of metal, b) providing at least one plated layer of metal, c) providing at least one thermal interface material, and d) layering the at least one deposition layer of metal, the at least one thermal interface material, and the at least one plated layer of metal to produce the layered thermal system. Methods of forming another contemplated layered thermal system comprise: a) providing a silicon die, layer or surface, b) providing at least one deposition layer of metal, c) providing at least one plated layer of metal, d) providing at least one thermal interface material, e) providing at least one heat spreader material, and f) layering the silicon surface, the at least one deposition layer of metal, the at least one thermal interface material, the at least one plated layer of metal and the at least one heat spreader to produce the layered thermal system.

摘要翻译： 本文描述了分层热界面系统，其包括：至少一个金属沉积层，至少一层热界面材料层，至少一层金属镀层和至少一个散热器。 本文描述了另一分层热界面系统，其包括：硅层，至少一层金属沉积层，至少一层热界面材料层，至少一层金属镀层和至少一个散热器预期形成的方法 分层热系统包括：a）提供金属的至少一个沉积层，b）提供至少一个金属镀层，c）提供至少一个热界面材料，以及d）分层所述至少一个金属沉积层， 所述至少一个热界面材料和所述至少一个金属镀层以产生所述分层热系统。 形成另一预期分层热系统的方法包括：a）提供硅晶片，层或表面，b）提供至少一层金属沉积层，c）提供至少一层金属镀层，d）提供至少一个热 界面材料，e）提供至少一个散热器材料，以及f）将所述硅表面，所述至少一个金属沉积层，所述至少一个热界面材料，所述至少一个金属镀层和至少 一个散热器产生分层热系统。

公开(公告)号：US20080047694A1

公开(公告)日：2008-02-28

申请号：US11511054

申请日：2006-08-27

申请人： Andrew D. Delano ,  Christian L. Belady

发明人： Andrew D. Delano ,  Christian L. Belady

IPC分类号： F28D15/00 ,  B29C47/88 ,  H05K7/20

CPC分类号： F28F3/12 ,  F28D15/00 ,  F28F3/022 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： Liquid heat exchangers and methods for removing heat from a central processing unit. An exemplary heat exchanger comprises a body having an open cavity whose periphery is sealable to the central processing unit from which heat is to be removed, a cooling liquid inlet port coupled through the body to the open cavity, and a liquid outlet port coupled through the body to the open cavity. Cooling liquid is pumped through the cavity when the body is sealed to the central processing unit, thereby contacting the central processing unit and removing heat from the central processing unit. A plurality of heat conducting elements may be provided that extend from an inner surface of the body into the open cavity, at least some of which have a length that is operative to contact the central processing unit. The heat conducting elements allow convective cooling of the central processing unit.

摘要翻译： 液体热交换器和从中央处理单元去除热量的方法。 示例性的热交换器包括具有开放空腔的主体，其外围可以密封到中央处理单元，中心处理单元将从其中除去热量，通过主体连接到开放空腔的冷却液入口和通过 身体到开放的腔。 当主体被密封到中央处理单元时，冷却液体被泵送通过空腔，从而接触中央处理单元并从中央处理单元去除热量。 可以提供多个导热元件，其从主体的内表面延伸到开放空腔中，其中至少一些导热元件的长度可操作以接触中央处理单元。 导热元件允许中央处理单元的对流冷却。

公开(公告)号：US06868899B1

公开(公告)日：2005-03-22

申请号：US10649519

申请日：2003-08-25

申请人： Joseph M. White ,  Andrew D. Delano

发明人： Joseph M. White ,  Andrew D. Delano

IPC分类号： F28F13/00 ,  H01L23/433 ,  F28F7/00

CPC分类号： H01L23/4338 ,  F28F13/00 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

摘要： A variable-height thermal-interface device is provided for transferring heat from a heat source to a sink. The device comprises a first uniaxial rotary cylindrical joint comprising a first cylindrically concave surface in slidable contact with a first cylindrically convex surface. The first cylindrically concave surface and the first cylindrically convex surface share a common first radius of curvature relative to a common first cylinder axis. The first cylindrically concave surface is operable to rotate about the common first cylinder axis relative to the first cylindrically concave surface to compensate for uniaxial angular misalignment between the source and the heat sink.

摘要翻译： 提供了一种可变高度的热接口装置，用于将热量从热源传送到水槽。 该装置包括第一单轴旋转圆柱形接头，其包括与第一圆柱形凸形表面可滑动接触的第一圆柱形凹形表面。 第一圆柱形凸表面和第一圆柱形凸表面相对于共同的第一气缸轴线具有共同的第一曲率半径。 第一圆柱形凹表面可操作以相对于第一圆柱形凹表面围绕公共第一气缸轴线旋转，以补偿源和散热器之间的单轴角度偏移。