公开(公告)号：US07155815B2

公开(公告)日：2007-01-02

申请号：US10859114

申请日：2004-06-03

申请人： Angelika Gernhardt ,  Thomas Goulet ,  Carsten Menzel ,  Waldemar Ollik

发明人： Angelika Gernhardt ,  Thomas Goulet ,  Carsten Menzel ,  Waldemar Ollik

IPC分类号： H03K3/34

CPC分类号： H05K3/403 ,  H05K1/0284 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/42 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49789

摘要： A method for contacting printed conductors terminating at the edge of a circuit board with printed conductors of a MID component includes: on a panel which includes the circuit board, producing the printed conductors of the circuit board in a layout in which the printed conductors are extended past a partition line which defines the edge of the circuit board; providing the panel with through holes along the partition line in the region of the printed conductors; electroplating through the through holes; isolating the circuit board from the panel; and positioning the circuit board in relation to the MID component and soldering the printed conductors of the circuit board to the printed conductors of the MID component. Rear electrical contacting areas are provided on a back side of the panel near the partition line, and the printed conductors are connected to the rear electrical contacting areas via the through holes.

摘要翻译： 用于将终端于电路板边缘的印刷导体与MID组件的印刷导体接触的方法包括：在包括电路板的面板上，以印刷导体延伸的布局产生电路板的印刷导体 通过限定电路板边缘的分隔线; 在印刷导体的区域中沿着分隔线提供通孔; 通过通孔电镀; 将电路板与面板隔离; 并将电路板相对于MID组件定位并将电路板的印刷导体焊接到MID组件的印刷导体。 后面的电气接触区域设置在靠近分隔线的面板的背面，并且印刷的导体经由通孔连接到后部电接触区域。