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1.发明申请公开(公告)号：US20060255424A1
公开(公告)日：2006-11-16
申请号：US11125473
申请日：2005-05-10
申请人： Anthony DiCarlo , Rabah Mezenner , James Baker , Mark Franklin , George Harakas
发明人： Anthony DiCarlo , Rabah Mezenner , James Baker , Mark Franklin , George Harakas
IPC分类号： H01L29/00
CPC分类号： G02B26/0833 , B81B2201/042 , B81B2203/0181 , B81C1/00801 , B81C2201/053
摘要： As robust hinge post structure for use with torsional hinged devices such as micromirrors and method of manufacturing is disclosed. The fabrication process uses a protective layer such as BARC on the bottom of the aperture used to form the hinge post structure to protect an oxide layer during an etching step. The oxide layer, in turn protects the metal layer at the bottom of the aperture. Therefore, the metal layer, the oxide layer, and the protective layer prevent the erosion and/or pitting of the bottom electrode during a cleaning process, and provide additional support to the structure.
摘要翻译： 公开了用于扭转铰接装置如微反射镜和制造方法的坚固的铰链柱结构。 制造工艺在用于形成铰链柱结构的孔的底部上使用诸如BARC的保护层，以在蚀刻步骤期间保护氧化物层。 氧化物层又保护孔的底部的金属层。 因此，金属层，氧化物层和保护层在清洁过程中防止底部电极的侵蚀和/或点蚀，并为结构提供额外的支撑。
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2.发明授权公开(公告)号：US07262900B2
公开(公告)日：2007-08-28
申请号：US11125473
申请日：2005-05-10
IPC分类号： G02B26/00
CPC分类号： G02B26/0833 , B81B2201/042 , B81B2203/0181 , B81C1/00801 , B81C2201/053
摘要： As robust hinge post structure for use with torsional hinged devices such as micromirrors and method of manufacturing is disclosed. The fabrication process uses a protective layer such as BARC on the bottom of the aperture used to form the hinge post structure to protect an oxide layer during an etching step. The oxide layer, in turn protects the metal layer at the bottom of the aperture. Therefore, the metal layer, the oxide layer, and the protective layer prevent the erosion and/or pitting of the bottom electrode during a cleaning process, and provide additional support to the structure.
摘要翻译： 公开了用于扭转铰接装置如微反射镜和制造方法的坚固的铰链柱结构。 制造工艺在用于形成铰链柱结构的孔的底部上使用诸如BARC的保护层，以在蚀刻步骤期间保护氧化物层。 氧化物层又保护孔的底部的金属层。 因此，金属层，氧化物层和保护层在清洁过程中防止底部电极的侵蚀和/或点蚀，并为结构提供额外的支撑。
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公开(公告)号：US07252395B2
公开(公告)日：2007-08-07
申请号：US11372686
申请日：2006-03-10
IPC分类号： G02B26/00
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array fabricated on a semiconductor substrate. The array is comprised of three operating layers. An addressing layer is fabricated on the substrate. A hinge layer is spaced above the addressing layer by an air gap. A mirror layer is spaced over the hinge layer by a second air gap. The hinge layer has a hinge under and attached to the mirror, the hinge permitting the mirror to tilt. The hinge layer further has spring tips under the mirror, which are attached to the addressing layer. These spring tips provide a stationary landing surface for the mirror.
摘要翻译： 制造在半导体衬底上的微镜阵列。 该阵列由三个操作层组成。 在衬底上制造寻址层。 铰链层通过气隙在寻址层上方间隔开。 镜层通过第二气隙在铰链层上间隔开。 铰链层具有在镜子下方并附接到铰链上的铰链，铰链允许镜子倾斜。 铰链层还具有在镜下的弹簧尖端，其附接到寻址层。 这些弹簧尖端为镜子提供了固定的着陆面。
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公开(公告)号：US07654677B2
公开(公告)日：2010-02-02
申请号：US11834583
申请日：2007-08-06
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.
摘要翻译： 制造在半导体衬底11上的微镜阵列110.阵列110由三个工作层12,13,14组成。寻址层12被制造在衬底上。 铰链层13通过气隙在寻址层12上方间隔开。 镜层14通过第二气隙在铰链层13上间隔开。 铰链层13在反射镜14a的下方并具有铰链13a，铰链13a允许反射镜14a倾斜。 铰链层13还具有安装在寻址层12下方的反射镜14a下面的弹簧尖端13c。这些弹簧顶端13c为反射镜14a提供固定的着陆面。
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公开(公告)号：US20070285757A1
公开(公告)日：2007-12-13
申请号：US11834583
申请日：2007-08-06
申请人： Anthony DiCarlo , Patrick Oden , Richard Knipe , Rabah Mezenner , James Huffman
发明人： Anthony DiCarlo , Patrick Oden , Richard Knipe , Rabah Mezenner , James Huffman
IPC分类号： G02B26/08
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.
摘要翻译： 制造在半导体衬底11上的微镜阵列110。 阵列110由三个操作层12,13,14组成。 在衬底上制造寻址层12。 铰链层13通过气隙在寻址层12上方间隔开。 镜层14通过第二气隙在铰链层13上间隔开。 铰链层13具有在反射镜14a下面并附接到铰链13a上的铰链13a，铰链13a允许反射镜14a倾斜。 铰链层13还具有附接到寻址层12的反射镜13a下的弹簧尖端13c。 这些弹簧尖端13c为反射镜14a提供固定的着陆面。
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公开(公告)号：US20060152690A1
公开(公告)日：2006-07-13
申请号：US11372686
申请日：2006-03-10
申请人： Anthony DiCarlo , Patrick Oden , Richard Knipe , Rabah Mezenner , James Huffman
发明人： Anthony DiCarlo , Patrick Oden , Richard Knipe , Rabah Mezenner , James Huffman
IPC分类号： G03B21/28
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.
摘要翻译： 制造在半导体衬底11上的微镜阵列110。 阵列110由三个操作层12,13,14组成。 在衬底上制造寻址层12。 铰链层13通过气隙在寻址层12上方间隔开。 镜层14通过第二气隙在铰链层13上间隔开。 铰链层13具有在反射镜14a下面并附接到铰链13a上的铰链13a，铰链13a允许反射镜14a倾斜。 铰链层13还具有附接到寻址层12的反射镜13a下的弹簧尖端13c。 这些弹簧尖端13c为反射镜14a提供固定的着陆面。
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公开(公告)号：US07011415B2
公开(公告)日：2006-03-14
申请号：US10298423
申请日：2002-11-18
IPC分类号： G02B26/00
CPC分类号： B81B3/0035 , G02B26/0841 , Y10T428/22
摘要： A micromirror array fabricated on a semiconductor substrate. The array is comprised of three operating layers. An addressing layer is fabricated on the substrate. A hinge layer is spaced above the addressing layer by an air gap. A mirror layer is spaced over the hinge layer by a second air gap. The hinge layer has a hinge under and attached to the mirror, the hinge permitting the mirror to tilt. The hinge layer further has spring tips under the mirror, which are attached to the addressing layer. These spring tips provide a stationary landing surface for the mirror.
摘要翻译： 制造在半导体衬底上的微镜阵列。 该阵列由三个操作层组成。 在衬底上制造寻址层。 铰链层通过气隙在寻址层上方间隔开。 镜层通过第二气隙在铰链层上间隔开。 铰链层具有在镜子下方并附接到铰链上的铰链，铰链允许镜子倾斜。 铰链层还具有在镜下的弹簧尖端，其附接到寻址层。 这些弹簧尖端为镜子提供了固定的着陆面。
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公开(公告)号：US20080113087A1
公开(公告)日：2008-05-15
申请号：US11558995
申请日：2006-11-13
申请人： Rabah Mezenner , Kiyomi Hirose , Satoshi Suzuki
发明人： Rabah Mezenner , Kiyomi Hirose , Satoshi Suzuki
CPC分类号： G02B26/0833 , B81B2201/047 , B81C1/00587 , B81C99/0065
摘要： The invention provides a method for quantifying over-etch of a conductive feature. In one embodiment, this method includes forming a conductive feature over a substrate, the conductive feature having a sheet resistance test structure associated therewith, the sheet resistance test structure having a first sheet resistance value. This method may further include etching the conductive feature and the sheet resistance test structure using a common etch process, obtaining a second sheet resistance value of the sheet resistance test structure after the etching, and quantifying an amount of over-etch into the conductive feature using the first and second sheet resistance values.
摘要翻译： 本发明提供了一种用于量化导电特征的过蚀刻的方法。 在一个实施例中，该方法包括在衬底上形成导电特征，该导电特征具有与其相关联的薄层电阻测试结构，薄层电阻测试结构具有第一薄层电阻值。 该方法还可以包括使用公共蚀刻工艺蚀刻导电特征和薄层电阻测试结构，在蚀刻之后获得薄层电阻测试结构的第二薄层电阻值，并且使用 第一和第二片电阻值。
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公开(公告)号：US07199917B2
公开(公告)日：2007-04-03
申请号：US11108259
申请日：2005-04-18
申请人： Cuiling Gong , Rabah Mezenner
发明人： Cuiling Gong , Rabah Mezenner
IPC分类号： G02B26/00
CPC分类号： G02B26/0841
摘要： According to one embodiment of the present invention a micro-mirror element comprises a lower layer, a first middle layer, a second middle layer, and a micro-mirror. The lower layer includes an address portion for receiving an address voltage and a bias portion for receiving a bias voltage respectively. The first middle layer is electrically coupled to the bias portion of the lower layer. The second middle layer is electrically coupled to the first middle layer. The micro-mirror is coupled to the second middle layer and comprises a reflective surface operable to selectively tilt, in response to an application of a bias voltage and an address voltage to the lower layer, to reflect a beam of light.
摘要翻译： 根据本发明的一个实施例，微镜元件包括下层，第一中间层，第二中间层和微镜。 下层包括用于接收地址电压的地址部分和用于分别接收偏置电压的偏置部分。 第一中间层电耦合到下层的偏压部分。 第二中间层电耦合到第一中间层。 微反射镜耦合到第二中间层并且包括反射表面，其可操作以响应于向下层施加偏置电压和寻址电压而选择性地倾斜以反射光束。
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公开(公告)号：US20090130303A1
公开(公告)日：2009-05-21
申请号：US11941416
申请日：2007-11-16
申请人： Rabah Mezenner
发明人： Rabah Mezenner
CPC分类号： G02B26/0841
摘要： A reflective and deformable micromirror device comprises a reflective micromirror plate attached to a deformable hinge that is formed on and held by a hinge post on a substrate. The substrate has an addressing electrode formed thereon. A selected dielectric material is disposed between the deformable hinge and the addressing electrode.
摘要翻译： 反射和可变形的微反射镜装置包括附接到形成在基板上的铰链柱上并由其固定的可变形铰链的反射微镜板。 衬底具有形成在其上的寻址电极。 所选择的电介质材料设置在可变形铰链和寻址电极之间。
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