公开(公告)号：US09034752B2

公开(公告)日：2015-05-19

申请号：US13733508

申请日：2013-01-03

申请人： Hongqi Li ,  Anurag Jindal ,  Irina Vasilyeva

发明人： Hongqi Li ,  Anurag Jindal ,  Irina Vasilyeva

IPC分类号： H01L21/4763 ,  H01L21/768 ,  H01L23/538

CPC分类号： H01L21/76865 ,  H01L21/7684 ,  H01L21/76841 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5384 ,  H01L2924/0002 ,  Y10S438/927 ,  H01L2924/00

摘要： Methods of exposing conductive vias of semiconductor devices may comprise conformally forming a barrier material over conductive vias extending from a backside surface of a substrate. A self-planarizing isolation material may be formed over the barrier material. An exposed surface of the self-planarizing isolation material may be substantially planar. A portion of the self-planarizing isolation material, a portion of the barrier material, and a portion of protruding material of the conductive vias may be removed to expose the conductive vias. Removal of the self-planarizing isolation material, the barrier material, and the conductive vias may be stopped after exposing at least one laterally extending portion of the barrier material.

摘要翻译： 暴露半导体器件的导电通孔的方法可以包括在从衬底的背面延伸的导电通孔上保形地形成阻挡材料。 可以在阻挡材料之上形成自平坦化隔离材料。 自平坦化隔离材料的暴露表面可以是基本上平面的。 可以去除自平坦化隔离材料的一部分，阻挡材料的一部分和导电通孔的突出材料的一部分，以露出导电通路。 在暴露阻挡材料的至少一个横向延伸部分之后，可以停止去除自平坦化隔离材料，阻挡材料和导电通孔。

公开(公告)号：US20130320538A1

公开(公告)日：2013-12-05

申请号：US13485539

申请日：2012-05-31

申请人： Anurag Jindal ,  Hongqi Li

发明人： Anurag Jindal ,  Hongqi Li

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a through-substrate via includes forming a through-substrate via opening at least partially through a substrate from one of opposing sides of the substrate. A first material is deposited to line and narrow the through-substrate via opening. The first material is etched to widen at least an elevationally outermost portion of the narrowed through-substrate via opening on the one side. After the etching, a conductive second material is deposited to fill the widened through-substrate via opening. Additional implementations are disclosed. Integrated circuit substrates are disclosed independent of method of manufacture.

摘要翻译： 形成贯通基板通孔的方法包括通过至少部分地通过基板从衬底的相对侧中的一个开口至少部分地形成穿通基板。 沉积第一种材料以通过开口对直通基板进行线并使其变窄。 第一材料被蚀刻以在一侧通过开口加宽变窄的通过基板的至少最高的最外部分。 在蚀刻之后，沉积导电的第二材料以通过开口填充加宽的通过基板。 公开了其他实现。 独立于制造方法公开了集成电路基板。

公开(公告)号：US08911558B2

公开(公告)日：2014-12-16

申请号：US13069408

申请日：2011-03-23

申请人： Hongqi Li ,  Anurag Jindal ,  Jin Lu

发明人： Hongqi Li ,  Anurag Jindal ,  Jin Lu

IPC分类号： B08B3/12 ,  B08B6/00 ,  B08B7/00 ,  B08B7/02 ,  C25C1/00 ,  C25F3/30 ,  C25F5/00 ,  C11D11/00 ,  C11D7/26 ,  H01L21/02

CPC分类号： C11D11/0047 ,  C11D7/265 ,  H01L21/02074

摘要： A post-W CMP cleaning solution consists of carboxylic acid and deionized water. The carboxylic acid may be selected from the group consisting of (1) monocarboxylic acids; (2) dicarboxylic acids; (3) tricarboxylic acids; (4) polycarboxylic acids; (5) hydroxycarboxylic acids; (6) salts of the above-described carboxylic acids; and (7) any combination thereof. The post-W CMP cleaning solution can work well without adding any other chemical additives such as surfactants, corrosion inhibitors, pH adjusting agents or chelating agents.

摘要翻译： CMP后清洁溶液由羧酸和去离子水组成。 羧酸可以选自（1）一元羧酸; （2）二羧酸; （3）三羧酸; （4）多元羧酸; （5）羟基羧酸; （6）上述羧酸的盐; 和（7）其任何组合。 后CMP扫描溶液可以很好的工作，而不需要添加任何其他化学添加剂，如表面活性剂，腐蚀抑制剂，pH调节剂或螯合剂。

公开(公告)号：US20140183740A1

公开(公告)日：2014-07-03

申请号：US13733508

申请日：2013-01-03

申请人： Hongqi Li ,  Anurag Jindal ,  Irina Vasilyeva

发明人： Hongqi Li ,  Anurag Jindal ,  Irina Vasilyeva

IPC分类号： H01L21/768 ,  H01L23/538

CPC分类号： H01L21/76865 ,  H01L21/7684 ,  H01L21/76841 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5384 ,  H01L2924/0002 ,  Y10S438/927 ,  H01L2924/00

摘要： Methods of exposing conductive vias of semiconductor devices may comprise conformally forming a barrier material over conductive vias extending from a backside surface of a substrate. A self-planarizing isolation material may be formed over the barrier material. An exposed surface of the self-planarizing isolation material may be substantially planar. A portion of the self-planarizing isolation material, a portion of the barrier material, and a portion of protruding material of the conductive vias may be removed to expose the conductive vias. Removal of the self-planarizing isolation material, the barrier material, and the conductive vias may be stopped after exposing at least one laterally extending portion of the barrier material.

摘要翻译： 暴露半导体器件的导电通孔的方法可以包括在从衬底的背面延伸的导电通孔上保形地形成阻挡材料。 可以在阻挡材料之上形成自平坦化隔离材料。 自平坦化隔离材料的暴露表面可以是基本上平面的。 可以去除自平坦化隔离材料的一部分，阻挡材料的一部分和导电通孔的突出材料的一部分，以露出导电通孔。 在暴露阻挡材料的至少一个横向延伸部分之后，可以停止去除自平坦化隔离材料，阻挡材料和导电通孔。

公开(公告)号：US09330975B2

公开(公告)日：2016-05-03

申请号：US13485539

申请日：2012-05-31

申请人： Anurag Jindal ,  Hongqi Li

发明人： Anurag Jindal ,  Hongqi Li

IPC分类号： H01L21/768 ,  H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a through-substrate via includes forming a through-substrate via opening at least partially through a substrate from one of opposing sides of the substrate. A first material is deposited to line and narrow the through-substrate via opening. The first material is etched to widen at least an elevationally outermost portion of the narrowed through-substrate via opening on the one side. After the etching, a conductive second material is deposited to fill the widened through-substrate via opening. Additional implementations are disclosed. Integrated circuit substrates are disclosed independent of method of manufacture.

摘要翻译： 形成贯通基板通孔的方法包括通过至少部分地通过基板从衬底的相对侧中的一个开口至少部分地形成穿通基板。 沉积第一种材料以通过开口对直通基板进行线并使其变窄。 第一材料被蚀刻以在一侧通过开口加宽变窄的通过基板的至少最高的最外部分。 在蚀刻之后，沉积导电的第二材料以通过开口填充加宽的通过基板。 公开了其他实现。 独立于制造方法公开了集成电路基板。

公开(公告)号：US08667667B1

公开(公告)日：2014-03-11

申请号：US13005727

申请日：2011-01-13

申请人： Diep L. Nguyen ,  Jifang Tian ,  Hongqi Li

发明人： Diep L. Nguyen ,  Jifang Tian ,  Hongqi Li

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B25/043 ,  G11B19/2018

摘要： A disk drive includes a disk drive base comprising a first metal material. The disk drive base may include a first opening and a first attachment feature to which a head actuator assembly pivot may be attached. A motor support may be embedded in the first opening in the disk drive base. The motor support consists of a second metal material having a damping coefficient higher than that of the first metal material. A rotary spindle may be attached to the motor support, and a disk may be attached to the rotary spindle.

摘要翻译： 磁盘驱动器包括包括第一金属材料的磁盘驱动器基座。 磁盘驱动器底座可以包括第一开口和第一附接构件，头部致动器组件枢轴可以附接到第一连接构件。 电动机支撑件可以嵌入在盘驱动器底座中的第一开口中。 电动机支架由具有比第一金属材料的阻尼系数高的阻尼系数的第二金属材料组成。 旋转主轴可以附接到电动机支撑件，并且盘可以附接到旋转主轴。

公开(公告)号：US08125740B1

公开(公告)日：2012-02-28

申请号：US12778033

申请日：2010-05-11

申请人： Jian Yang ,  Jifang Tian ,  Qiang Yang ,  Hongqi Li

发明人： Jian Yang ,  Jifang Tian ,  Qiang Yang ,  Hongqi Li

IPC分类号： G11B21/02

CPC分类号： G11B5/5573

摘要： A disk drive has an actuator coil that includes first and second lateral legs joined by first and second longitudinal legs to form a closed coil periphery. The first lateral leg is disposed closer to the actuator pivot bore than the second lateral leg. The first and second longitudinal legs join the second lateral leg at a first interior bend location and at a second interior bend location within the closed coil periphery, respectively. A bobbin is disposed within the closed coil periphery and contacts the conductive coil at two locations (e.g. the first interior bend location and the second interior bend location). Preferably, the bobbin defines a total bobbin length and an average bobbin width, and the total bobbin length is at least 3 times the average bobbin width.

摘要翻译： 磁盘驱动器具有致动器线圈，其包括由第一和第二纵向腿连接以形成闭合线圈周边的第一和第二横向腿。 第一侧腿比第二侧腿更靠近致动器枢轴孔设置。 第一和第二纵向腿分别在第一内部弯曲位置和闭合线圈周边内的第二内部弯曲位置处连接第二侧向支腿。 线圈架设置在封闭的线圈周边内，并在两个位置（例如，第一内部弯曲位置和第二内部弯曲位置）处接触导电线圈。 优选地，筒管限定总筒管长度和平均筒管宽度，并且总筒管长度是平均筒管宽度的至少3倍。

公开(公告)号：US08116038B1

公开(公告)日：2012-02-14

申请号：US12779225

申请日：2010-05-13

申请人： Qing Zhang ,  Hongqi Li ,  David K. Myers ,  Enoch Mylabathula

发明人： Qing Zhang ,  Hongqi Li ,  David K. Myers ,  Enoch Mylabathula

IPC分类号： G11B21/16

CPC分类号： G11B5/5569 ,  G11B5/4833

摘要： A novel disk drive head stack assembly (HSA) includes a first head gimbal assembly attached to a first actuator arm. A dummy mass is attached to a second actuator arm. The dummy mass includes a mounting plate portion defining a mounting plate width. The mounting plate portion includes first and second projections. The dummy mass also includes a neck portion defining a neck width and a neck length. A root portion of the neck portion is disposed between the first and second projections, and defines first and second alcoves between the root portion and the first and second projections, respectively. The dummy mass also includes a distal mass portion defining a distal mass width and a distal mass length. The neck width is less than the mounting plate width, and the neck width is less than the distal mass width.

摘要翻译： 一种新颖的磁盘驱动器磁头组合组件（HSA）包括附接到第一致动器臂的第一磁头万向架组件。 虚拟质量块附接到第二致动器臂。 虚拟物质包括限定安装板宽度的安装板部分。 安装板部分包括第一和第二突起。 虚拟块还包括限定颈部宽度和颈部长度的颈部。 颈部的根部设置在第一和第二突起之间，并且分别在根部与第一和第二突起之间限定第一和第二壁口。 虚拟质量还包括限定远端质量宽度和远端质量长度的远端质量部分。 颈部宽度小于安装板宽度，颈部宽度小于远端质量宽度。

公开(公告)号：US09116066B1

公开(公告)日：2015-08-25

申请号：US13458863

申请日：2012-04-27

申请人： Jifang Tian ,  Hongqi Li ,  William Flynn ,  Xiaoping Hu ,  Francisco Obregon

发明人： Jifang Tian ,  Hongqi Li ,  William Flynn ,  Xiaoping Hu ,  Francisco Obregon

IPC分类号： G01M7/02

CPC分类号： G01M7/027

摘要： A vibration testing apparatus comprises a first mooring bar coupled to the base; a second mooring bar coupled to the base such that the second mooring bar is disposed away from and faces the first mooring bar to define a space between the first and second mooring bars; a first strap comprising a first end secured to the first mooring bar, and a second strap comprising a first end secured to the first mooring bar. A second end of each of the first and second straps may be secured to the second mooring bar such that the first and second straps span the space between the first and second mooring bars and such that a tension on at least one of the first and second strap is controllable.

摘要翻译： 一种振动试验装置，包括：一个连接到基座的第一系泊杆; 联接到所述基座的第二系泊杆，使得所述第二系泊杆远离所述第一系泊杆并且面向所述第一系泊杆以限定所述第一和第二系泊杆之间的空间; 第一带包括固定到第一系泊杆的第一端和包括固定到第一系泊杆的第一端的第二带。 第一和第二条带中的每一个的第二端可以被固定到第二系泊杆，使得第一和第二带跨过第一和第二系泊杆之间的空间，并且使得第一和第二带中的至少一个上的张力 表带是可控的。

公开(公告)号：US09263459B1

公开(公告)日：2016-02-16

申请号：US14498673

申请日：2014-09-26

申请人： Hongqi Li ,  Gowrisankar Damarla ,  Roger Lindsay ,  Zailong Bian ,  Jin Lu ,  Shyam Ramalingam ,  Prasanna Srinivasan

发明人： Hongqi Li ,  Gowrisankar Damarla ,  Roger Lindsay ,  Zailong Bian ,  Jin Lu ,  Shyam Ramalingam ,  Prasanna Srinivasan

IPC分类号： H01L21/8226 ,  H01L21/331 ,  H01L21/8222 ,  H01L21/336 ,  H01L29/66 ,  H01L27/115

CPC分类号： H01L23/528 ,  H01L27/11524 ,  H01L27/11529 ,  H01L27/11556

摘要： A three dimensional or stacked circuit device includes a conductive channel cap on a conductor channel. The channel cap can be created via selective deposition or other process to prevent polishing down the conductive material to isolate the contacts. The conductor channel extends through a deck of multiple tiers of circuit elements that are activated via a gate. The gate is activated by electrical potential in the conductor channel. The conductive cap on the conductor channel can electrically connect the conductor channel to a bitline or other signal line, and/or to another deck of multiple circuit elements.

摘要翻译： 三维或堆叠电路器件包括在导体通道上的导电通道盖。 可以通过选择性沉积或其它工艺来产生通道盖，以防止抛光导电材料以隔离触点。 导体通道延伸穿过通过门激活的多层电路元件。 门通过导体通道中的电位激活。 导体通道上的导电盖可以将导体通道电连接到位线或其他信号线，和/或电连接到多个电路元件的另一层。