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    Laser integration techniques
    1.
    发明授权
    Laser integration techniques 有权

    公开(公告)号：US11171464B1

    公开(公告)日：2021-11-09

    申请号：US16714575

    申请日：2019-12-13

    申请人： Apple Inc.

    发明人： Michael J. Bishop ,  Jason Pelc ,  Vijay M. Iyer ,  Alex Goldis

    IPC分类号： H01S5/02355 ,  G02B6/13 ,  H01S5/0234 ,  H01S5/02234 ,  H01S5/02251 ,  H01S5/02345 ,  G02B6/12 ,  H01S5/024

    摘要： Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

    Photonics assembly with a photonics die stack
    2.
    发明授权
    Photonics assembly with a photonics die stack 有权

    公开(公告)号：US11881678B1

    公开(公告)日：2024-01-23

    申请号：US17015766

    申请日：2020-09-09

    申请人： Apple Inc.

    发明人： Michael J. Bishop ,  Kwan-Yu Lai ,  Alex Goldis ,  Alfredo Bismuto ,  Jeffrey Thomas Hill

    IPC分类号： H01S5/00 ,  H01S5/40 ,  G02B3/06 ,  G02B26/08 ,  G02B26/10 ,  G02B6/12

    CPC分类号： H01S5/0071 ,  G02B3/06 ,  G02B6/12 ,  G02B26/0833 ,  G02B26/105 ,  H01S5/4043 ,  H01S5/4087

    摘要： Configurations for a photonics assembly and the operation thereof are disclosed. The photonics assembly may include multiple photonics dies which may be arranged in an offset vertical stack. The photonics dies may emit light, and in some examples, an optical element may be a detector for monitoring properties such as the wavelength of the light. The photonics dies may be arranged in a stack as a package and the packages may be stacked or arranged side by side or both for space savings. The PIC may include combining and/or collimating optics to receive light from the photonics dies, a mirror to redirect the light, and an aperture structure. The aperture structure may include a region which is at least partially transparent such that light transmits through the transparent region of the aperture structure. The aperture structure may include an at least partially opaque region which may be used for directing and/or controlling the light launch position.

    Laser Integration Techniques
    3.
    发明申请
    Laser Integration Techniques 有权

    公开(公告)号：US20220131340A1

    公开(公告)日：2022-04-28

    申请号：US17519355

    申请日：2021-11-04

    申请人： Apple Inc.

    发明人： Michael J. Bishop ,  Jason Pelc ,  Vijay M. Iyer ,  Alex Goldis

    IPC分类号： H01S5/02355 ,  G02B6/13 ,  H01S5/0234 ,  H01S5/02234 ,  H01S5/02251 ,  H01S5/02345

    摘要： Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.