公开(公告)号：US10199778B2

公开(公告)日：2019-02-05

申请号：US15201580

申请日：2016-07-04

Applicant: Apple Inc.

Inventor： Min Chul Kim ,  Paul Yuan ,  Joshua J. Pong ,  Joseph Tang

IPC: H01R13/6592 ,  H01R12/53 ,  H01R43/02 ,  H01R43/048 ,  H01R13/6463 ,  H01R13/6471 ,  H02G15/08 ,  H01R4/02 ,  H01R9/03 ,  H01R13/66 ,  H01R107/00

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

公开(公告)号：US20170133798A1

公开(公告)日：2017-05-11

申请号：US15201580

申请日：2016-07-04

Applicant: Apple Inc.

Inventor： Min Chul Kim ,  Paul Yuan ,  Joshua J. Pong ,  Joseph Tang

IPC: H01R13/6592 ,  H01R12/53 ,  H02G15/08 ,  H01R43/02 ,  H01R43/048 ,  H01R4/02 ,  H01R13/6463

CPC classification number: H01R13/6592 ,  H01R4/02 ,  H01R4/023 ,  H01R9/035 ,  H01R12/53 ,  H01R13/6463 ,  H01R13/6471 ,  H01R13/6658 ,  H01R43/0249 ,  H01R43/048 ,  H01R2107/00 ,  H02G15/08 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49181 ,  Y10T29/49213

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.