公开(公告)号：US11552053B2

公开(公告)日：2023-01-10

申请号：US16912000

申请日：2020-06-25

申请人： Apple Inc.

发明人： Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Praveesh Chandran

IPC分类号： H01L25/065 ,  G02B6/38 ,  G02B6/36 ,  H01L23/00 ,  H01L25/16 ,  G02B6/42

摘要： Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.

公开(公告)号：US20210405313A1

公开(公告)日：2021-12-30

申请号：US16912000

申请日：2020-06-25

申请人： Apple Inc.

发明人： Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Praveesh Chandran

IPC分类号： G02B6/42 ,  G02B6/38 ,  G02B6/36

摘要： Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.

公开(公告)号：US20210090908A1

公开(公告)日：2021-03-25

申请号：US16911153

申请日：2020-06-24

申请人： Apple Inc.

发明人： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

摘要： Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

公开(公告)号：US10306350B1

公开(公告)日：2019-05-28

申请号：US16043027

申请日：2018-07-23

申请人： Apple Inc.

发明人： Tsu-Hui Lin ,  Wenrui Cai ,  Xiaoyang Zhang ,  Yuta Kuboyama ,  Praveesh Chandran

IPC分类号： H04R1/10 ,  G01S17/08

摘要： An electronic device may include an optical proximity sensor system. The optical proximity sensor system may be a transreflective optical proximity sensor system having a light emitter that emits light into a light-emitting region and a light detector that detects light in a light-detecting region. Control circuitry in the device can use the transreflective optical proximity sensor system to detect objects in an object detection region formed where the light-emitting region and light-detecting region overlap. The electronic device may be a pair of headphones in which housing structures such as housing walls define ear cup cavities. Speakers may be provided in the ear cups of the headphones to provide sound to the ear cup cavities. The transreflective optical proximity sensor system can detect the presence of a user's ear in an ear cup cavity.

公开(公告)号：US11651976B2

公开(公告)日：2023-05-16

申请号：US16911153

申请日：2020-06-24

申请人： Apple Inc.

发明人： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/48135

摘要： Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

公开(公告)号：US20230386865A1

公开(公告)日：2023-11-30

申请号：US18316962

申请日：2023-05-12

申请人： Apple Inc.

发明人： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065

CPC分类号： H01L21/565 ,  H01L24/13 ,  H01L21/568 ,  H01L23/5389 ,  H01L23/5383 ,  H01L23/49827 ,  H01L23/49811 ,  H01L23/3121 ,  H01L24/97 ,  H01L21/561 ,  H01L25/0655 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/02373 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/02372 ,  H01L2224/48135

摘要： Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

公开(公告)号：US20220225006A1

公开(公告)日：2022-07-14

申请号：US17149552

申请日：2021-01-14

申请人： Apple Inc.

发明人： Nicholas P. Allec ,  Yuta Kuboyama ,  Xiaoyang Zhang ,  Xi Chen ,  Ryan M. Buck ,  Praveesh Chandran ,  Yifei Wang ,  Tingjun Xu

IPC分类号： H04R1/10 ,  G02B5/28 ,  A61B5/00

摘要： A wearable electronic device such as an earbud, wristwatch, or other device may be provided with a skin sensor. The skin sensor may use optical measurements to detect the presence of skin adjacent to the electronic device. The sensor may have first and second light-emitting devices such as infrared devices that emit light at respective first and second infrared light wavelengths. Reflected light is monitored by a photodetector. Control circuitry can initiate or pause audio playback or take other actions in response to determining from the reflected light measurements that skin is present. The sensor may have a thin-film interference filter or other optical structure that overlaps the first and second light-emitting devices to narrow the angular spread of light emitted from the skin sensor. This reduces tilt sensitivity and helps enhance skin sensor accuracy.