公开(公告)号：US20210090908A1

公开(公告)日：2021-03-25

申请号：US16911153

申请日：2020-06-24

Applicant: Apple Inc.

Inventor： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

公开(公告)号：US20230386865A1

公开(公告)日：2023-11-30

申请号：US18316962

申请日：2023-05-12

Applicant: Apple Inc.

Inventor： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L21/565 ,  H01L24/13 ,  H01L21/568 ,  H01L23/5389 ,  H01L23/5383 ,  H01L23/49827 ,  H01L23/49811 ,  H01L23/3121 ,  H01L24/97 ,  H01L21/561 ,  H01L25/0655 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/02373 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/02372 ,  H01L2224/48135

Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

公开(公告)号：US11651976B2

公开(公告)日：2023-05-16

申请号：US16911153

申请日：2020-06-24

Applicant: Apple Inc.

Inventor： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/48135

Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.