公开(公告)号：US20140146495A1

公开(公告)日：2014-05-29

申请号：US14171623

申请日：2014-02-03

Applicant: Apple Inc.

Inventor： Joseph Fisher, JR. ,  Sean Mayo ,  Dennis R. Pyper ,  Paul Nangeroni ,  Jose Mantovani

IPC: H05K9/00

CPC classification number: H05K9/0084 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/15192 ,  H05K3/284 ,  H05K9/0092 ,  H05K2201/0715 ,  H05K2201/09509 ,  H01L2924/00

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰，可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。

公开(公告)号：US09226435B2

公开(公告)日：2015-12-29

申请号：US14171623

申请日：2014-02-03

Applicant: Apple Inc.

Inventor： Joseph Fisher, Jr. ,  Sean Mayo ,  Dennis R. Pyper ,  Paul Nangeroni ,  Jose Mantovani

IPC: H05K5/00 ,  H05K9/00 ,  H05K3/28 ,  H01L23/552

CPC classification number: H05K9/0084 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/15192 ,  H05K3/284 ,  H05K9/0092 ,  H05K2201/0715 ,  H05K2201/09509 ,  H01L2924/00

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰，可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。